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One-component adhesive and preparation method thereof

A one-component, adhesive technology, used in adhesives, adhesive additives, epoxy resin adhesives, etc., can solve the problems of unstable product performance, poor high temperature resistance, high product defect rate, and achieve good connection reliability. , good fluidity, the effect of improving the service life

Active Publication Date: 2015-11-25
SHENZHEN PROSPER DOBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention solves the technical problems of the existing single-component adhesives such as poor high temperature resistance, high defect rate and unstable product performance, and provides a kind of adhesive with good fluidity, long-term preservation, high temperature resistance and high temperature resistance Reaching 300 ℃, one-component adhesive with fast curing speed and preparation method thereof

Method used

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  • One-component adhesive and preparation method thereof
  • One-component adhesive and preparation method thereof
  • One-component adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The adhesive of this embodiment is configured from the following raw materials in weight percentages:

[0033]

[0034]

[0035] The specific configuration steps can be:

[0036] First mix the 862 epoxy resin, cycloaliphatic epoxy resin and black pigment uniformly, then add the N-copper salt of imidazole, aluminum oxide, nano calcium carbonate and electroplated nickel, mix under cooling and drying conditions, and control by cold water bath At 25°C, the mixture is uniformly mixed and vacuumed for 25 minutes. When the above materials are uniformly mixed, hexanediol diglycidyl ether is added and mixed, and vacuum is vacuumed for 60 minutes to obtain sample S1.

Embodiment 2

[0038]

[0039] The specific configuration steps can be:

[0040] First mix 862 epoxy resin, cycloaliphatic epoxy resin and black pigment uniformly, then add the N-copper salt of imidazole, organic bentonite, aluminum oxide, nano calcium carbonate and electroplated nickel, and mix under cooling and drying conditions. The cold water bath is controlled at 25°C, and the mixture is uniformly mixed and vacuumed for 25 minutes. When the above materials are uniformly mixed, hexanediol diglycidyl ether is added and mixed, and vacuum is vacuumed for 60 minutes to obtain sample S2.

Embodiment 3

[0042] The adhesive was prepared using the same method and steps as in Example 1, except that the following raw materials were used in weight percentages:

[0043]

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Abstract

The invention provides a one-component adhesive and a preparation method thereof. The adhesive comprises epoxy resin, a latent curing agent, inorganic powder and an accelerant, wherein the epoxy resin comprises liquid epoxy resin and low-viscosity modified epoxy resin; the inorganic powder comprises aluminum-containing inorganic powder; and the accelerant comprises a modified nickel salt complex accelerant. The one-component adhesive is good in liquidity, can be stored at low temperature, and can be high-temperature resistant; the heat-resistant temperature can reach 300 DEG C; and meanwhile, the curing speed is high.

Description

Technical field [0001] The invention relates to a single-component adhesive and a preparation method thereof. Background technique [0002] With the trend of portable electronic products, lighter and thinner, more flexible printed circuit boards are used more and more, which requires electronic equipment to have higher shock resistance and reliability. High production capacity, miniaturization, and lead-free assembly It has become the mainstream of the electronics industry, and it has also accelerated the general application of high temperature environment technology such as electronic circuits and assembly, equipment fixtures or pipelines, but it has put forward higher requirements for product reliability, making the performance of high temperature resistant adhesives The important factors affecting productivity, such as high defect rate, poor stability, high repair rate, and high scrap rate, have become common problems. [0003] At present, two-component adhesives are commonly u...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06
Inventor 刘行程丹丹
Owner SHENZHEN PROSPER DOBOND TECH
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