Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate
A technology for printed circuit boards and manufacturing methods, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuits, etc., and can solve the unrecorded advantages of solder mask composition, patterning method implementation mode or example, conductor pattern exposure, and unproposed Achieve the effect of excellent smear removal resistance by solving problems such as the realization method
Active Publication Date: 2014-08-27
TAIYO HLDG CO LTD
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Problems solved by technology
For example, Patent Document 2 proposes to use NC milling or the like to remove the solder resist near the outer edge of the chip to form a level difference, but it is not sufficient to form a high-definition dam.
In addition, Patent Document 2 also proposes a method of removing the uncured part of the photocurable resist to form a groove around the chip, but when the amount of underfill reaching the groove is insufficient, there is a conductor located in the dam groove. Problems with patterns being exposed unnecessarily
Furthermore, Patent Document 2 also proposes a method of forming protrusions (protrusion pieces) by applying a resist on the solder resist layer by screen printing or the like, but it is difficult to form high-definition protrusions in such formation by coating. department
In addition, it describes the technical idea that an alkali-developing type or a UV-curable resist can be used for the protrusion, but does not describe the advantages of this case, the composition of the solder resist layer, the patterning method, and other specific embodiments or implementations. For example, no specific implementation method is proposed
Method used
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[0242] The present invention will be specifically described below by showing examples and comparative examples, but the present invention is not limited to the following examples. In addition, the following "parts" and "%" refer to a mass basis unless otherwise specified.
[0243] (Preparation of varnishes for L1 and L2)
[0244] The ingredients shown in the following Table 1 were mixed according to the ratio (parts by mass) shown in the table, pre-mixed with a mixer, and then kneaded with a three-roll mill to prepare a photocurable resin composition varnish for L1 . Similarly, the ingredients shown in the following Table 2 were mixed according to the ratios (parts by mass) shown in the table, pre-mixed with a mixer, and then kneaded with a three-roll mill to prepare a thermosetting resin combination for L2. object varnish.
[0245] [Table 1]
[0246]
[0247] *1: R-2000PG, solid content 65% (manufactured by DIC Corporation)
[0248] *2: CYCLOMER P(ACA)Z250, solid cont...
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Abstract
Provided are: a dry film capable of forming a curable coating exhibiting excellent laser processability and desmear resistance; and a printed wiring board using said dry film. Also provided are: a method for producing a printed wiring board for a flip chip mounting substrate whereby it is possible to easily form a dam for preventing the spreading of underfill; a printed wiring board produced by means of said method; and a flip chip mounting substrate in which a chip is flip-chip mounted on said printed wring board. A dry film characterized by being provided with a carrier film and a photocurable resin composition layer (L1) formed by coating and drying a photocurable resin composition, wherein at least a thermosetting resin composition layer (L2) formed by coating and drying a thermosetting resin composition is disposed between the carrier film and the photocurable resin composition layer (L1). A method for producing a printed wiring board, the method being characterized by involving: a step for forming a resin insulating layer on a substrate surface, said resin insulating layer having the thermosetting resin composition layer (L2) and the photocurable resin composition layer (L1) in said order from the side of the substrate surface; a step for forming a pattern by means of a photolithography method; and a step for forming a pattern by means of laser processing.
Description
technical field [0001] The present invention relates to a dry film and a printed wiring board using the same. Specifically, it relates to a dry film capable of forming a cured film excellent in laser processability and desmear resistance, and a printed wiring board using the same. In addition, the present invention relates to a method of manufacturing a printed wiring board, a printed wiring board obtained by the manufacturing method, and a flip-chip mounting substrate. Specifically, it relates to a printed wiring board capable of easily forming a dam for preventing underfill from spreading. A manufacturing method, a printed circuit board manufactured by the method, and a flip-chip mounting substrate obtained by flip-chip mounting a chip on the printed circuit board. Background technique [0002] Generally, in printed circuit boards used in electronic equipment, etc., when mounting electronic components on the printed circuit board, in order to prevent solder from adhering t...
Claims
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IPC IPC(8): B32B27/08H05K3/28
CPCH05K3/0082Y10T428/31515H01L23/49894H01L2224/92125H05K1/0353H01L23/49816H05K3/3436H01L2224/73204Y10T428/24975H05K1/0373H05K3/281G03F7/40H05K1/036H05K2201/10977H01L21/563H05K2201/10674H05K2201/0195H05K3/4611B32B27/08B32B27/16B32B27/20B32B2264/102B32B2264/104B32B2307/202B32B2307/206B32B2457/08
Inventor 岩山弦人远藤新峰岸昌司有马圣夫
Owner TAIYO HLDG CO LTD