Large wafer cleaning machine

Abstract

The invention discloses a large wafer cleaning machine. The large wafer cleaning machine comprises a machine frame (6) and a high-pressure air drying device (15). A loading work table (7), ultrasonic cleaning tanks (9), ultrasonic vibration plates, a slow-pulling dehydration tank (10) and a conveying device (12) are arranged at the lower-middle portion of the machine frame (6), and a slowdown motor, a guide rail (2) and a single-arm manipulator (3) are arranged at the upper portion of the machine frame (6). The single-arm manipulator (3) is arranged on the guide rail (2) in a striding mode and driven to move horizontally on the guide rail (2) by the slowdown motor, an air cylinder (4) is arranged at the upper end of the single-arm manipulator (3), the slowdown motor is arranged below the back of the air cylinder (4), and the air cylinder (4) enables the single-arm manipulator (3) to move vertically. The machine frame (6) is further provided with a controller (5) electrically connected with the slowdown motor (1) and the air cylinder (4). The large wafer cleaning machine has the advantages that the automation degree is high, the product yield is high, the product quality is high and the energy consumption is low.

Description

technical field [0001] The invention relates to a cleaning machine, in particular to a large sheet cleaning machine. Background technique [0002] In production and life, there are many things that need to be cleaned, and there are many types and links that need to be cleaned. Therefore, in order to cope with the many things that need to be cleaned, a variety of cleaning equipment has appeared in the society, and a variety of cleaning processes have been adopted, such as dipping, brushing, pressure washing, vibration cleaning and steam cleaning, etc., but when faced with The surface of the items to be cleaned is relatively complex, such as some mechanical parts with uneven surfaces and blind holes, and some products that are particularly small and have high requirements for cleanliness, such as: clocks and precision machinery parts, electronic components, circuits Board components, etc.; conventional cleaning methods can no longer meet the requirements, even steam cleaning ...

AI Technical Summary

Problems solved by technology

[0005] At present, the wafer cleaning process is to place the wafers scattered in the cleaning frame, shake them up and down in a single-slot ultrasonic machine, go through two superwashes, one rinse, and then dry them in an oven to complete the final work, but the wafers are scattered in the cleaning process. In the frame, the wafers are stacked together and it is difficult to separate them. The wafers are not cleaned cleanly, and manual work is required for shaking and cleaning and moving between different tanks. The wafers are dried in an oven, and high-temperature baking affects the physical properties of the wafers.

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