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water cooling device

A technology of water-cooling device and pumping device, which is applied in cooling/ventilation/heating transformation, instrumentation, electrical digital data processing, etc., and can solve problems such as heat removal from heat sinks, heat energy discharge, and inability to fully achieve heat dissipation, and achieve increased Heat dissipation performance and life extension effect

Active Publication Date: 2018-05-18
蔡柏彬
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The heat dissipation method of the current water-cooled heat dissipation module, in the process of heat dissipation, the main source of heat energy comes from heating elements such as the central processing unit, and the heat sink with better thermal conductivity of copper or aluminum is directly connected to the heating element For heat conduction, traditionally, only one side of a heat sink (device) is attached to the heating element, and the other side is used for heat exchange with the cooling fluid in the water-cooled heat dissipation module. However, the heat exchange efficiency of this structure Not good, because the heat dissipation area for heat exchange between the heat sink (device) and the cooling fluid is too small, so that the cooling fluid passes quickly and cannot take away the heat absorbed by the heat sink. The person who conducts heat exchange between the heat sink and the cooling fluid arranges multiple cylinders or flow channels to increase the heat dissipation area, but the effect is still not good, and it can only slightly improve the heat dissipation performance, so it cannot be directly and effectively The heat energy is discharged, and the heat dissipation effect cannot be fully achieved
[0003] In addition, when the pump device in the known water-cooling module is in operation, the stator assembly will generate heat during operation, and because the stator assembly in the known technology must be isolated from the cooling fluid, it is only air-cooled Self-cooling, but the cooling effect is not good, the excessive heat accumulation of the stator assembly will cause burnout, and the heat accumulation problem of the stator assembly will further affect the service life of the water cooling module
[0004] In the known technology, in order to prevent the stator assembly of the pump from being damaged due to receiving liquid, the stator assembly is arranged outside the water-cooling module, and the rotor assembly that guides the cooling fluid to circulate in the water-cooling module is arranged on the water-cooling module. Inside the group, and between the two through the shell of the water-cooling module to generate excitation correspondingly, and because the shell of the water-cooling module must consider the strength of its own structure, so it has a certain thickness, then between the rotor assembly and the stator assembly, The operation efficiency of the pump is affected due to the spacing caused by the shell thickness of the water-cooling module, which affects the overall heat dissipation performance of the water-cooling module.

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Embodiment Construction

[0072] The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.

[0073] see figure 1 , figure 2 , is a three-dimensional disassembly and three-dimensional cross-sectional view of the first embodiment of the water cooling device of the present invention. As shown in the figure, the water cooling device 1 of the present invention includes: a body 11;

[0074] The body 11 has a pump chamber 111 and a heat exchange chamber 112, which are separated by a water chamber partition 12, and the water chamber partition 12 has a communicating portion 121, so that the pump chamber The chamber 111 and the heat exchange chamber 112 are connected, the pump chamber 111 is provided with a pumping device 13, the aforementioned heat exchange chamber 112 is provided with a heat transfer unit 14, the pump chamber 111 and the heat exchange chamber The chamber 112 is...

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Abstract

A water-cooling device, comprising: a water-cooling device, comprising: a body having a pump chamber and a heat exchange chamber, the two are separated by a water chamber partition, and the water chamber partition has a communication part, so that the pumping chamber and the heat exchange chamber are connected, the pumping chamber is provided with a pumping device, the heat exchange chamber is provided with a heat transfer unit, the pumping chamber and the heat exchange chamber The room is filled with a cooling fluid, and the water cooling device of the present invention can greatly increase the heat dissipation performance, and can further solve the problem of overheating of the stator assembly.

Description

technical field [0001] A water-cooling device, especially a water-cooling device that can improve heat dissipation performance and at the same time solve the problem of overheating of internal stator components. Background technique [0002] The heat dissipation method of the current water-cooled heat dissipation module, in the process of heat dissipation, the main source of heat energy comes from heating elements such as the central processing unit, and the heat sink with better thermal conductivity of copper or aluminum is directly connected to the heating element For heat conduction, traditionally, only one side of a heat sink (device) is attached to the heating element, and the other side is used for heat exchange with the cooling fluid in the water-cooled heat dissipation module. However, the heat exchange efficiency of this structure Not good, because the heat dissipation area for heat exchange between the heat sink (device) and the cooling fluid is too small, so that ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20H05K7/20
Inventor 蔡柏彬
Owner 蔡柏彬