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Backward traceability of discrete components and forward traceability of semiconductor devices

A semiconductor and traceability technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve time-consuming traceability and other problems

Inactive Publication Date: 2017-11-14
SANDISK SEMICON SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the devices 90 from the various assembly lots in 54-81 are combined and shuffled into a test lot in 54-62, and then re-shuffled in the card lot in 54-99, even if possible, It is also difficult and time-consuming to trace back devices identified as problematic during the memory or card testing phase using traditional MES

Method used

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  • Backward traceability of discrete components and forward traceability of semiconductor devices
  • Backward traceability of discrete components and forward traceability of semiconductor devices
  • Backward traceability of discrete components and forward traceability of semiconductor devices

Examples

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Embodiment Construction

[0036] will now refer to Figures 4 to 13 Embodiments are described that relate to systems that enable backward traceability of semiconductor device manufacturing processes to individual semiconductor die or other discrete components and forward traceability of individual devices and components through memory and card testing. It should be appreciated that the technology may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the invention to those skilled in the art. Indeed, the system is intended to cover alternatives, modifications and equivalents of these embodiments, which are included within the scope and spirit of the system as defined by the appended claims.

[0037] In general, the present technology provides a means of uniquely identifying each semiconductor device and providing a correlation betwe...

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Abstract

A system for providing backward and forward traceability by means of identifying discrete components (die, substrate, and / or passive components) in a semiconductor device is disclosed. The present technology also includes a method for generating a unique identifier and marking a semiconductor device with the unique identifier so that the semiconductor device, and discrete components within the device, pass every process and test in producing the semiconductor device Be tracked and traced.

Description

[0001] This invention is a divisional application of the following invention patent application: application number: 201080040554.4, application date: October 4, 2010, invention name: backward traceability of discrete components and forward traceability of semiconductor devices. technical field [0002] This technology relates to the manufacture of semiconductor devices. Background technique [0003] The strong growth in demand for portable consumer electronic devices has driven the demand for high-capacity storage devices. Nonvolatile semiconductor memory devices, such as flash memory cards, are becoming widely used to meet the increasing demand for digital information storage and exchange. Its portability, versatility and robust design, as well as its high reliability and large capacity have made this memory device ideal for use in a variety of electronic devices including, for example, digital cameras, digital music players, video game consoles, PDAs and cellular phone. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L23/544
Inventor D.查维特C.俞H.塔基亚F.卢董至强J.史
Owner SANDISK SEMICON SHANGHAI
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