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Water-cooled structure of reflow soldering furnace and wind motor and reflow soldering furnace

A technology for wind motors and reflow ovens, which is applied in wind power generation, electrical components, electromechanical devices, etc., which can solve the problems of inconvenience and easy burnout of wind motors, so as to avoid overheating, reduce maintenance costs, and prevent damage Effect

Active Publication Date: 2017-07-11
BEIJING TORCH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing reflow soldering machine uses the fan blades driven by the wind motor to achieve the wind effect; however, the fan blades rotate in the temperature zone, which will bring a lot of heat to the wind motor, especially when the wind motor is working continuously at high temperature , the wind turbine is easy to be burned
[0004] This shows that the above-mentioned existing reflow oven obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.

Method used

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  • Water-cooled structure of reflow soldering furnace and wind motor and reflow soldering furnace
  • Water-cooled structure of reflow soldering furnace and wind motor and reflow soldering furnace
  • Water-cooled structure of reflow soldering furnace and wind motor and reflow soldering furnace

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Embodiment Construction

[0038] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the following will be combined with the accompanying drawings and preferred embodiments to describe the water-cooled structure of the reflow oven motor and the specific implementation of the reflow oven according to the present invention. , structure, feature and effect thereof, detailed description is as follows. In the following description, different "one embodiment" or "embodiment" do not necessarily refer to the same embodiment. Furthermore, the particular features, structures, or characteristics of one or more embodiments may be combined in any suitable manner.

[0039] The present invention provides a water-cooling structure for a reflow soldering furnace wind motor, comprising a water-cooled aluminum base 4, a motor shaft hole 6 is provided in the middle of the water-cooled aluminum base 4, and a wind-running motor 1 is connected...

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Abstract

The invention discloses a fan motor water cooling structure of a reflow soldering furnace. The fan motor water cooling structure comprises a water cooling aluminum base, a motor shaft hole is formed in the middle of the water cooling aluminum base, and a fan motor is connected above the water cooling aluminum base. A motor shaft penetrates into the motor shaft hole, and one end of the motor shaft is connected with a fan. A water cooling channel is formed in the water cooling aluminum base, and the water cooling channel is provided with a water outlet and a water inlet formed in the water cooling aluminum base. The fan motor water cooling structure of the reflow soldering furnace and the reflow soldering furnace cannot be damaged easily and can operate continuously under a high temperature environment.

Description

technical field [0001] The invention relates to the field of electronic placement equipment, in particular to a water-cooling structure of a reflow soldering furnace wind motor and a reflow soldering furnace. Background technique [0002] The desktop reflow soldering machine is a kind of welding equipment commonly used in the SMT (Surface Mount Technology) industry. Its processing mainly includes: 1. Place one or more PCB circuit boards in the heating box of the reflow soldering machine; 2. Evenly distributed heating tubes are used to uniformly heat the PCB circuit board in a high-temperature environment. After a certain period of time, the one-time soldering of the solder joints on the surface of the PCB circuit board is completed; 3. Turn on the cooling fan on the heating box to quickly cool the PCB circuit board. , take out the PCB circuit board, and the soldering process is completed. In the whole process, in order to ensure the uniform heating temperature of the reflow...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02K9/06H02K5/20H02K5/173
CPCY02E10/72
Inventor 赵永先张延忠王建建
Owner BEIJING TORCH CO LTD
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