Young's modulus test structure and method of film material

Abstract

The invention provides a Young modulus testing structure and method for a thin film material. The testing structure is composed of two sets of structures, wherein in the first set of the structure, a cantilever beam (103) manufactured by the thin film material to be detected is composed of an anchor region (103-2) and a long beam (103-1) which are connected; the long beam (103-1) is vertical to a polycrystalline silicon cantilever beam (101); the free end of the long beam (103-1) is located below a left first convex point (101-5) of the polycrystalline silicon cantilever beam (101); a loading driving part of a force is separated from the Young modulus testing structure manufactured by the thin film material to be detected; the bending deflection of the testing structure is controlled through a geometrical parameter design; the force applied to the Young modulus testing structure is extracted by virtue of a principle that the same parts of the two sets of the testing structures have the same stress; the Young modulus of the thin film material to be detected is calculated through the force and the deflection. The testing structure, a measurement method and a calculation method for parameter extraction are very simple and have wide adaptability, and can be used for testing the Young modulus of a conductive or insulating thin film material.

Description

technical field [0001] The invention provides a testing structure for the Young's modulus of a film material. The invention belongs to the technical field of microelectromechanical system (MEMS) material parameter testing. Background technique [0002] The performance of MEMS is closely related to the material parameters. Due to the influence of the processing process, some material parameters will change. These uncertain factors caused by the processing technology will make device design and performance prediction uncertain and unstable. The purpose of material parameter testing is to be able to measure the material parameters of MEMS devices manufactured by a specific process in real time, monitor the stability of the process, and feed back the parameters to the designer so that the design can be corrected. Therefore, testing without leaving the processing environment and using general-purpose equipment has become a necessary means of process monitoring. The physical pa...

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Problems solved by technology

For insulating materials, such as silicon nitride, silicon dioxide, and single crystal silicon or polycrystalline silicon wrapped by silicon dioxide, it is not easy to directly load and detect test signals due to their insulating properties.

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