A crystalline silicon solar cell passivation material Al2O3 concentration gradient doped ZNO thin film and its preparation method
A technology of solar cells and concentration gradients, applied in circuits, photovoltaic power generation, electrical components, etc., can solve the problems that passivation films cannot be put into practical use on a large scale and cannot achieve passivation effects, and achieve strong chemical passivation and field passivation Effect, excellent passivation effect, effect of improving minority carrier lifetime
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Embodiment 1
[0030] There is a layer of Al with a thickness of 1nm on the silicon wafer 2 o 3 thin film layer, in Al 2 o 3 The thin film layer has a concentration gradient doped ZnO thin film layer, the Al 2 o 3 The concentration gradient doped ZnO thin film layer is composed of Al element, Zn element and O element, among which Al 2 o 3 Concentration Gradient Doping of Al in ZnO Thin Film Layer 2 o 3The proportion decreases from bottom to top, and its resistivity decreases successively. The content of Al element is 0.1%~10%, the thickness is 100nm, and the resistivity is 10Ω·cm~1?10 -5 Ω·cm.
[0031] Specific steps are as follows:
[0032] (1) Place the silicon wafer in the deposition chamber of the atomic deposition equipment, and vacuum the deposition chamber. The deposition temperature is 150°C, the pressure is 0.15 torr, the gas flow rate is 40 sccm, and Al(CH 3 ) 3 The precursor was purged for 20ms, and the deposition chamber was cleaned with high-purity nitrogen for 25s, a...
Embodiment 2
[0037] There is a layer of Al with a thickness of 10nm on the silicon wafer 2 o 3 thin film layer, in Al 2 o 3 The thin film layer has a concentration gradient doped ZnO thin film layer, the Al 2 o 3 The concentration gradient doped ZnO thin film layer is composed of Al element, Zn element and O element, among which Al 2 o 3 Concentration Gradient Doping of Al in ZnO Thin Film Layer 2 o 3 The proportion decreases from bottom to top, and its resistivity decreases successively. The content of Al element is 0.1%~10%, the thickness is 30nm, and the resistivity is 10Ω·cm~1?10 -5 Ω·cm.
[0038] The specific steps are as follows:
[0039] (1) Place the silicon wafer in the deposition chamber of the atomic deposition equipment, evacuate the deposition chamber, and inject Al(CH 3 ) 3 Precursor, cleaning the deposition chamber with high-purity nitrogen gas and passing water vapor into the deposition chamber as an oxygen source, and then cleaning the deposition chamber with hi...
Embodiment 3
[0044] There is a layer of Al with a thickness of 5nm on the silicon wafer 2 o 3 thin film layer, in Al 2 o 3 The thin film layer has a concentration gradient doped ZnO thin film layer, the Al 2 o 3 The concentration gradient doped ZnO thin film layer is composed of Al element, Zn element and O element, among which Al 2 o 3 Concentration Gradient Doping of Al in ZnO Thin Film Layer 2 o 3 The proportion decreases from bottom to top, and its resistivity decreases successively. The content of Al element is 0.1%~10%, the thickness is 50nm, and the resistivity is 10Ω·cm~1?10 -5 Ω·cm.
[0045] The specific steps are as follows:
[0046] (1) Place the silicon wafer in the deposition chamber of the atomic deposition equipment, evacuate the deposition chamber, and inject Al(CH 3 ) 3 Precursor, cleaning the deposition chamber with high-purity nitrogen gas and passing water vapor into the deposition chamber as an oxygen source, and then cleaning the deposition chamber with hig...
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