Method for mixed cutting of ceramic substrate LED based on combined cutter
A ceramic substrate, combined technology, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of easy burnout of silica gel, expansion of secondary positioning errors, low efficiency, etc., to improve processing quality and prolong use. effect of life
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[0021] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0022] Such as figure 1 And and figure 2 As shown, the combined tool includes a main shaft 1, a main shaft flange 2, more than two cutting tools, a flange gasket 4, a gasket 5 and a locking device 6. The main shaft flange 2 is set on the main shaft 1 and is integrated with the main shaft; the cutters are two, including a front cutter 31 and a rear cutter 32; as image 3 As shown, the front end of the flange gasket 4 is provided with a boss 41 for positioning the front cutter 31; The end faces of the flange gaskets outside are compressed on the rear cutter 32; the gasket end faces near the front cutter 31 are provided with a groove 52 extending outwards from the hole through which the main axis passes, and the gasket end faces beyond the groove 62 are pressed against it. The front tool in contact; the locking device is a lock nut; ...
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