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Integrated circuit MCM-3D packaging structure and packaging method

A technology of integrated circuits and packaging structures, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of high efficiency and small size, and achieve the effects of high efficiency, small size and small internal resistance

Inactive Publication Date: 2014-09-17
江阴苏阳电子股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Traditional DC-to-DC integrated circuits cannot meet the needs of the electronic product market for high voltage, high current, small size, and high efficiency

Method used

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  • Integrated circuit MCM-3D packaging structure and packaging method
  • Integrated circuit MCM-3D packaging structure and packaging method
  • Integrated circuit MCM-3D packaging structure and packaging method

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Experimental program
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Effect test

Embodiment

[0050]

[0051] It can be seen from the above embodiments that the integrated circuit MCM-3D packaging structure of the present invention has the following advantages:

[0052] 1. The superiority in circuit design inherently improves performance parameters such as the output current of the circuit. Using the external MOS tube to get rid of the inherent defects of the built-in components, you can use a higher power MOS tube.

[0053] 2. In terms of packaging design, advanced MCM-3D packaging is adopted. In the wafer grinding process, ultra-thin thinning technology is used to thin the chip, and the thickness of the chip is reduced to less than 200um. On the one hand, it is beneficial to the needs of packaging, and on the other hand On the one hand, it also improves the heat dissipation performance of components. In the loading process, the loading film is used to stack chips on the chip (3D), which greatly improves the efficiency of loading. After the chip mounting is complet...

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PUM

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Abstract

The invention relates to an integrated circuit MCM-3D packaging structure which comprises a frame. The integrated circuit MCM-3D packaging structure is characterized in that a first chip (1) and a second chip (2) are sequentially stacked at one position of a frame carrier (4) of the frame, a third chip (3) is placed at the other position of the frame carrier (4), a chip packaging film is arranged on the reverse side of the second chip (2), the first chip (1), the second chip (2) and the third chip (3) are in bonding with frame pins through copper wires or gold wires, and the first chip (1), the second chip (2), the third chip (3) and the frame are wrapped in a molding compound to form a whole integrated circuit. The integrated circuit MCM-3D packaging structure and a packaging method are applied to DC / DC integrated circuits and can meet the requirements of the electronic product market for a high voltage, a large current, a small size and high efficiency.

Description

technical field [0001] The invention relates to an integrated circuit MCM-3D packaging structure and a packaging method, belonging to the technical field of semiconductor packaging. Background technique [0002] A DC-to-DC integrated circuit (DC-DC circuit) refers to a circuit that converts a fixed DC voltage into a variable DC voltage. [0003] As the requirements for power supply in the application of electronic products change, such as higher voltage, higher current, smaller size, and higher efficiency, the traditional DC-to-DC integrated circuit method can no longer meet the requirements for some applications. [0004] The traditional DC-to-DC integrated circuits on the market are mainly monolithic integrated circuits of BCD process. The chip is small, and the MOS tube is integrated in a single chip. The DC-to-DC integrated circuit uses a planar packaging of a control circuit and an external MOS tube in a package. Due to the limited internal space of the package, it is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L21/50
CPCH01L2924/00011H01L2224/0603H01L2224/45144H01L2224/45147H01L2224/48137H01L2224/48247H01L2224/49171H01L2924/01004H01L2924/00014
Inventor 王辉刘晓民诸伟
Owner 江阴苏阳电子股份有限公司
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