Multi-section "Feng"-shaped approximately-cyclical flexible substrate structure and three-dimensional packaging method thereof
A flexible substrate, three-dimensional packaging technology, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., to achieve the effect of reducing length, improving convenience, and simple process
Inactive Publication Date: 2014-09-24
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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[0007] In view of this, the main purpose of the present invention is to provide a multi-section "Feng"-shaped periodic flexible substrate structure and its three-dimensional packaging method to solve the problem of docking between sub-packages of different flexible substrates due to the uncertainty of flexible substrates. problems, while improving the convenience of production and making full use of the spatial structure of the circuit
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[0032] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.
[0033] Such as image 3 as shown, image 3 It is a structural schematic diagram of a multi-section "Feng"-shaped periodic flexible substrate according to an embodiment of the present invention. The substrate includes a plurality of chips and a periodic flexible substrate. The multiple chips are arranged on the periodic flexible substrate in a two-dimensional manner. On the flexible substrate, some of the chips are arranged on the central axis of this type of periodic flexible substrate in the order of "one", and the remaining chips are arranged on both sides of the chips arranged in the order of "one", and are located on both sides of the central axis. Chips are not provided on both sides of the chip at the end. Wherein...
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The invention discloses a multi-section "Feng"-shaped approximately-cyclical flexible substrate structure and a three-dimensional packaging method thereof, wherein "Feng" is a Chinese character with three parallel short bars vertical to a long bar in the middle. The substrate comprises a plurality of chips and an approximately-cyclical flexible substrate. The chips are arranged on the flexible substrate two-dimensionally. Some of the chips are arranged on the central axis of the flexible substrate one by one linearly, the rest of the chips are arranged on two sides of the linearly-arranged chips, and no chips are arranged on two sides of the chips on two ends of the central axis. The structure and the method solve the butt joint problem of sub-packages of different flexible substrates brought by uncertainty of flexible substrates. Meanwhile, the convenience of manufacturing is improved, and the spatial structure of a circuit is fully utilized.
Description
technical field [0001] The invention relates to the technical field of three-dimensional system-level packaging of microelectronics, in particular to a multi-section "Feng"-like periodic flexible substrate structure and a three-dimensional packaging method thereof. Background technique [0002] Existing flexible substrates mainly have two structures, specifically as Figure 1a with Figure 2a As shown, they are the monolithic structure and the elongated overall structure. Each chip in the monolithic package is attached to its own substrate, while all the chips in the elongated overall structure are attached to a elongated flexible substrate. [0003] for Figure 1a The flexible substrate shown in the figure mainly uses the stacking method for three-dimensional packaging, and its three-dimensional packaging structure is as follows Figure 1b shown. The stacking method for three-dimensional packaging is to first flip-chip solder different bare chips on different flexible sub...
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IPC IPC(8): H01L23/498H01L25/00H01L21/50
Inventor 廖安谋侯峰泽张霞
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI