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A Method for Testing Residual Stress of Large-Sized Grinding Wafers

A test method and residual stress technology, which is applied in the direction of measuring force, measuring devices, instruments, etc., can solve the problems of high cost and inability to accurately characterize the residual stress on the surface of the ground wafer, etc.

Active Publication Date: 2016-06-22
TIANJIN RES INST FOR ADVANCED EQUIP TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the physical testing method has high test efficiency, its cost is high, and most physical measurement methods can only obtain the residual stress value in one direction, which cannot accurately characterize the residual stress on the surface of the ground wafer

Method used

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  • A Method for Testing Residual Stress of Large-Sized Grinding Wafers
  • A Method for Testing Residual Stress of Large-Sized Grinding Wafers
  • A Method for Testing Residual Stress of Large-Sized Grinding Wafers

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Embodiment Construction

[0020] The specific implementation steps of the present invention will be described in detail below in conjunction with the accompanying drawings

[0021] Equipment preparation: metal foil strain gauge, XL2118C static strain gauge, plastic film, lead wire, 502 glue, protractor, ruler, nitrogen lead-free reflow oven and grinding wafer.

[0022] Grind wafers available; testing locations identified figure 1 , Use a protractor and ruler to position and mark the angle on the wafer grinding surface to be tested, and wipe the position to be tested and its surroundings with a cotton ball soaked in acetone or absolute ethanol until the cotton ball is white;

[0023] Number the strain gauges a, b, and c, apply a thin layer of 502 glue on the base of the numbered strain gauges, align the strain gauges with the markings on the patch, and stick the sheets, cover the surface of the strain gauges with a plastic film and use a large Gently press with your thumb, and roll without slipping fro...

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Abstract

The invention discloses a method for testing residual stress of a large-size grinding wafer, which belongs to the field of residual stress testing. The steps include: providing a grinding wafer; cleaning and pasting a resistance strain gauge at the test position; using a nitrogen lead-free reflow oven to solder the lead wire on the strain gauge and the strain gauge contact, and correcting and clearing the strain gauge; Measure the mechanical opening in the center of the circle for stress relief; record the strain value through the strain gauge and organize the data to calculate the residual stress. The invention has the advantages of simple operation, multi-directional residual stress measurement, and little damage to the wafer.

Description

technical field [0001] The invention relates to a method for testing the residual stress of a large-size grinding wafer, in particular to a method for testing the residual stress of a large-size grinding wafer by using a stress release method. Background technique [0002] With the rapid development of IC manufacturing technology, in order to increase the output of IC chips and reduce the cost of unit manufacturing, the wafer tends to be larger in diameter. The diameter of the wafer was only 2 inches at first, and it developed to 4 inches (100mm) in 1975. In 1987, it developed to 6-inch (150mm), 8-inch (200mm) wafers were used in 1992, and 12-inch (300mm) wafers were used in chip manufacturing plants in 2000. By 2004, 24 300mm wafers had been established in the world. The chip production line is expected to start manufacturing 36nm technology node semiconductor chips on 18-inch (450mm) wafers in 2012. [0003] As the diameter of the wafer increases, in order to ensure that ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/22
Inventor 秦飞孙敬龙安彤王仲康唐亮
Owner TIANJIN RES INST FOR ADVANCED EQUIP TSINGHUA UNIV