Manufacturing method of flexible electronic device and substrate for manufacturing flexible electronic device
A technology of a flexible electronic device and a manufacturing method, which is applied in the manufacture of a substrate for a flexible electronic device and the manufacture of a flexible electronic device, can solve the problems that the adhesive cannot be completely peeled off and the flexible substrate is damaged.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0030] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0031] Please refer to figure 1 , the manufacturing method of the flexible electronic device provided by the present invention, comprises the following steps:
[0032] providing channels 24 in the rigid substrate 20;
[0033] Using an adhesive 60 to attach the flexible substrate 40 to the rigid substrate 20;
[0034] Fabricating an electronic device 80 on the flexible substrate 40;
[0035] injecting chemical substance 200 into channel 24; and
[0036] The chemical substance 200 reacts with the adhesive 60 to peel the flexible substrate 40 from the rigid substrate 20 . The above-mentioned manu...
PUM

Abstract
Description
Claims
Application Information

- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2023 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap