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Manufacturing method of flexible electronic device and substrate for manufacturing flexible electronic device

A technology of a flexible electronic device and a manufacturing method, which is applied in the manufacture of a substrate for a flexible electronic device and the manufacture of a flexible electronic device, can solve the problems that the adhesive cannot be completely peeled off and the flexible substrate is damaged.

Inactive Publication Date: 2016-08-10
SHENZHEN ROYOLE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for manufacturing a flexible electronic device and a substrate for making a flexible electronic device, aiming at solving the problem that the adhesive existing in the process of peeling the flexible substrate and the rigid substrate cannot be completely peeled off in the prior art Problems causing damage to flexible substrates

Method used

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  • Manufacturing method of flexible electronic device and substrate for manufacturing flexible electronic device
  • Manufacturing method of flexible electronic device and substrate for manufacturing flexible electronic device
  • Manufacturing method of flexible electronic device and substrate for manufacturing flexible electronic device

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Embodiment Construction

[0030] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0031] Please refer to figure 1 , the manufacturing method of the flexible electronic device provided by the present invention, comprises the following steps:

[0032] providing channels 24 in the rigid substrate 20;

[0033] Using an adhesive 60 to attach the flexible substrate 40 to the rigid substrate 20;

[0034] Fabricating an electronic device 80 on the flexible substrate 40;

[0035] injecting chemical substance 200 into channel 24; and

[0036] The chemical substance 200 reacts with the adhesive 60 to peel the flexible substrate 40 from the rigid substrate 20 . The above-mentioned manu...

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Abstract

A method for manufacturing a flexible electronic device and a substrate for manufacturing the flexible electronic device. The manufacturing method includes: setting a channel (24) on the rigid base material (20); attaching the flexible base material (40) to the rigid base material (20) with an adhesive (60); Fabricating the electronic device (80); injecting chemicals into the channels (24); and reacting the chemicals with the adhesive (60) to peel the flexible substrate (40) from the rigid substrate (20). By arranging the channel (24) on the rigid substrate (20), the efficiency and speed of the chemical substance reacting with the binder (60) are enhanced.

Description

technical field [0001] The invention belongs to the field of manufacturing electronic devices, and in particular relates to a method for manufacturing flexible electronic devices and a substrate for manufacturing flexible electronic devices. Background technique [0002] Flexible electronic devices are emerging electronic technologies that make organic / inorganic material electronic devices on flexible / ductile plastic or thin metal substrates. Medical, national defense and other fields have broad application prospects, such as flexible electronic displays, organic light-emitting diodes (OLEDs), printed RFID, thin-film solar panels, and electronic skin patches (SkinPatches). [0003] Due to the problems of fragility, wrinkling and deformation of flexible substrates, it is particularly prominent in the actual production process. The common manufacturing method of flexible electronic devices is to use a specific adhesive to attach the flexible substrate and the rigid substrate ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/50H01L51/56H01L23/32B32B7/12B32B25/00
CPCH10K77/111B32B7/12B32B7/06B32B2307/748B32B2457/00Y02E10/549Y02P70/50H10K71/80H05K3/02H05K3/30
Inventor 刘自鸿余晓军魏鹏
Owner SHENZHEN ROYOLE TECH CO LTD
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