Method for tapping on independent research board card block sheet for satisfying heat dissipation

A technology for researching board cards and baffles, which is applied in the fields of instruments, electrical digital data processing, and digital data processing parts, etc., and can solve the problems of inability to install fans, small main chip area, and unsatisfactory effects.

Inactive Publication Date: 2014-10-15
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the graphics card, this method is possible, because the display chip of the graphics card has a large area and can accommodate a small cooling fan, but the main chips such as Modem and sound card have a small area and cannot be installed with a fan.
Therefore, the common method of heat dissipation for these boards is very unsatisfactory.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] A self-developed board block includes a block body and a block hook. The block body has honeycomb heat dissipation holes, and the edge of the block body has heat dissipation grooves.

[0015] The side length of the honeycomb cooling holes is 0.2 cm.

[0016] The coverage area of ​​the honeycomb cooling holes is 1 / 3 of the area of ​​the main body of the baffle.

[0017] A self-developed board block to meet the heat dissipation method, the specific steps are:

[0018] ① Select the specifications of the self-developed board block according to the board specifications;

[0019] ② Install the self-developed board block on the corresponding hook hole of the board through the block hook;

[0020] ③ Stretch the self-developed board block to make sure the installation is firm and complete.

Embodiment 2

[0022] A self-developed board block includes a block body and a block hook. The block body has honeycomb heat dissipation holes, and the edge of the block body has heat dissipation grooves.

[0023] The side length of the honeycomb cooling holes is 0.3 cm.

[0024] The coverage area of ​​the honeycomb cooling holes is 2 / 3 of the area of ​​the main body of the baffle.

[0025] The vertical cross-sectional area of ​​the heat sink is trapezoidal.

[0026] A self-developed board block to meet the heat dissipation method, the specific steps are:

[0027] ① Select the specifications of the self-developed board block according to the board specifications;

[0028] ② Install the self-developed board block on the corresponding hook hole of the board through the block hook;

[0029] ③ Stretch the self-developed board block to make sure the installation is firm and complete.

Embodiment 3

[0031] A self-developed board block includes a block body and a block hook. The block body has honeycomb heat dissipation holes, and the edge of the block body has heat dissipation grooves.

[0032] The side length of the honeycomb cooling holes is 0.4 cm.

[0033] The coverage area of ​​the honeycomb cooling holes is 3 / 4 of the area of ​​the main body of the baffle.

[0034] A self-developed board block to meet the heat dissipation method, the specific steps are:

[0035] ① Select the specifications of the self-developed board block according to the board specifications;

[0036] ② Install the self-developed board block on the corresponding hook hole of the board through the block hook;

[0037] ③ Stretch the self-developed board block to make sure the installation is firm and complete.

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PUM

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Abstract

The invention discloses a method for tapping on an independent research board card block sheet for satisfying heat dissipation, and belongs to the computer communication field. An independent research board card block sheet comprises a block sheet body and a block sheet hook, wherein the block sheet body is provided with alveolate heat dissipation holes; the edge of the block sheet body is provided with a heat dissipation groove; the side length of each alveolate heat dissipation hole is 0.2-0.5cm; the cover area of the alveolate heat dissipation holes does not exceed 4/5 of the area of the block sheet body; and the area of a vertical split cross section of the heat dissipation groove is trapezoidal. The method for the independent research board card block sheet comprises the following specific steps: 1) according to the specification of a board card, selecting the specification of the independent research board card block sheet; 2) installing the independent research board card block sheet onto a corresponding hook hole of the board card; and 3) stretching the independent research board card block sheet, and confirming that the independent research board card block sheet is firmly installed. The invention has the benefits that heat dissipation effect is enhanced, and damages caused by refitting the board cards are avoided.

Description

technical field [0001] The invention relates to a method for dissipating heat from a board, which belongs to the field of computer communication, and in particular to a method for opening holes on a self-developed board retainer to satisfy heat dissipation. Background technique [0002] With the development of computer technology and the popularization and expansion of computer applications, the new generation of self-developed boards has significantly improved performance and cache, and the heat dissipation of the main chip and memory particles of the boards is significantly higher than that of the previous generation. In the self-developed board, modify the baffle to increase the heat dissipation holes to meet the heat dissipation of the self-developed board. For various boards inserted in the motherboard expansion slots, such as: graphics card, sound card, built-in Modem, network card, etc., it is rarely taken into account. In fact, when the computer works for a long tim...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 鞠增伟
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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