Hybrid integrated circuit module and manufacturing method thereof

Abstract

A hybrid integrated circuit module and its manufacturing method, the manufacturing method comprising: making a substrate, a heat sink, and a glass fiber board with through holes at preset positions, and covering one surface of the substrate with an insulating layer; The glass fiber board and the radiator are arranged on the surface of the insulating layer; the circuit wiring layer is arranged on the surface of the glass fiber board; power elements and non-power elements are respectively arranged on the radiator and corresponding positions of the circuit wiring layer; Metal wires are connected between the circuit wiring layer, the heat sink, the power element, and the non-power element. Improve the contact reliability of the bonding point, shorten the length of the bonding line and reduce the height difference of the bonding line can effectively reduce the probability of line punching during molding, so that the manufacturing pass rate and long-term reliability of the intelligent power module are improved. promote.

Description

technical field [0001] The invention belongs to the field of electronic device manufacturing technology, and in particular relates to a hybrid integrated circuit module and a manufacturing method thereof. Background technique [0002] Intelligent Power Module (IPM) is a power drive product that combines power electronics and integrated circuit technology. IPM integrates power switching devices and high-voltage drive circuits, and has built-in fault detection circuits such as overvoltage, overcurrent and overheating. On the one hand, the IPM receives the control signal from the MCU to drive the subsequent circuits to work, and on the other hand, sends the system status detection signal back to the MCU. Compared with the traditional discrete solution, IPM wins more and more markets with its advantages of high integration and high reliability. It is especially suitable for frequency converters and various inverter power supplies for driving motors. An ideal power electronic d...

AI Technical Summary

Problems solved by technology

[0010] The present invention aims to solve the deficiencies of the prior art, and provides a hybrid integrated circuit module that uses conductive substances to electrically connect the circuit wiring layer and the substrate, and solves the problem that the excessive height difference between the power element and the circuit wiring will cause the bonding line to be flushed , off-line, resulting in low product yield and reliability

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