Device Mounting Structure and Integrated Circuit Module
A technology for mounting structures and integrated circuits, applied in circuits, electrical solid devices, semiconductor devices, etc., can solve the problems of unfavorable air discharge of solder paste, low manufacturing qualification rate, low solder void rate, etc. The effect of reducing product price, improving production efficiency and success rate
Inactive Publication Date: 2017-10-31
GD MIDEA AIR-CONDITIONING EQUIP CO LTD
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Problems solved by technology
[0008] The present invention aims to solve the deficiencies of the prior art, provide a device mounting structure that ensures an extremely low soldering void rate, and solve the problem that the air in the solder paste is not conducive to discharge when installing circuit devices in a traditional integrated circuit module, resulting in a high void rate , the problem of low manufacturing pass rate
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[0031] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0032] combine figure 2 (A), 2(C), as a device mounting structure in an embodiment, the device mounting structure is set on the solder resist layer 21 of the integrated circuit module, and the solder resist layer 21 is provided (opened or surrounded) for fixing In the groove 211 of the circuit device 14A, a plurality of slits 212 are provided on the side wall of the groove 211, and the minimum distance (L1 and L2) between the opposite side walls of the groove 211 is equal to the corresponding side length of the circuit device 14 (L1' and L2') are equal. That is, ...
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A device mounting structure, which is arranged on the solder resist layer of an integrated circuit module, the solder resist layer is provided with grooves for fixing circuit devices, the side wall of the groove is provided with a plurality of slits, and the groove The minimum distance between opposing sidewalls is equal to the corresponding side length of the device. When the circuit device is installed in the device mounting structure, the gap can help to discharge the air in the solder, and the minimum inner diameter between the side walls of the groove matches the size of the circuit device, and the edge of the circuit device and the edge of the solder mask layer There are still direct contact parts, so the position of the circuit device can still be precisely fixed while the circuit device can still be positioned by the solder mask without drifting or turning. In addition, the invention also provides an integrated circuit module.
Description
technical field [0001] The invention belongs to the field of electronic device manufacturing technology, and in particular relates to a device mounting structure and an integrated circuit module. Background technique [0002] Intelligent Power Module (IPM) is a power drive product that combines power electronics and integrated circuit technology. IPM integrates power switching devices and high-voltage drive circuits, and has built-in fault detection circuits such as overvoltage, overcurrent and overheating. On the one hand, the IPM receives the control signal from the MCU to drive the subsequent circuits to work, and on the other hand, sends the system status detection signal back to the MCU. Compared with the traditional discrete solution, IPM wins more and more markets with its advantages of high integration and high reliability. It is especially suitable for frequency converters and various inverter power supplies for driving motors. An ideal power electronic device for...
Claims
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IPC IPC(8): H01L23/488H01L25/00
CPCH01L2224/48091H01L2224/48247H01L2924/1305H01L2924/13055H01L2924/13091H01L2924/181
Inventor 冯宇翔
Owner GD MIDEA AIR-CONDITIONING EQUIP CO LTD