PCB (Printed Circuit Board) core plate made of Phenolic aldehyde

Abstract

The invention discloses a PCB (Printed Circuit Board) core plate made of phenolic aldehyde. The core plate comprises the following materials in parts by weight: 30 parts of epoxy resin SEC-250, 60 parts of epoxy resin SEB-5000, 50 parts of 2003 (phenolic aldehyde), 20 parts of DDS and 30 parts of ATH-2. Firstly, phenolic aldehyde is very good in compatibility with epoxy resins; secondly, after phenolic aldehyde is mixed with the epoxy resins in certain ratios, the viscosity is improved within the first 1-2 hours to some extent; thirdly, because of the relatively long device carbon chain, a cured product is relatively good in toughness, and the defect that the phenolic aldehyde is relatively poor in toughness when being cured, and as no micro molecules are generated when the product is heated in the curing process and after the curing process, the product is very good in electric property in the thermal state; fourthly, after being mixed with the epoxy resins, the components are slowly reacted at normal temperature, but if the temperature is greater than 120 DEG C, the components can be cured within 2-3 hours, small heat is released in curing, the control is easy, and the lamination time is shortened. Therefore, because of the synergic curing function of an amine curing agent added into a phenolic aldehyde curing system in certain ratios, the toughness, the peeling resistance and the like of a copper-clad plate material are improved to a large extent.

Description

technical field [0001] The invention relates to a PCB board, in particular to a core board of a PCB board. Background technique [0002] In the current prior art, a PCB core board made of phenolic material includes epoxy resin SEC-250, epoxy resin SEB-5000, 2003 (phenolic) and ATH-2. The existing problem is: With the rapid development of the lead-free era, the phenolic curing system has gradually replaced the dicyandiamide curing system, and the phenolic curing system can open and crosslink the epoxy group in the epoxy resin to form a network under heating conditions. Structure, this kind of curing agent not only maintains the good adhesion and dielectric properties of epoxy resin, but also has the heat resistance of phenolic resin. Generally, the long-term use temperature of bisphenol A type epoxy resin cured product does not exceed 200°C, but the long-term use temperature of phenolic cured epoxy resin cured product can reach 260°C, and the glass transition temperature can...

AI Technical Summary

Problems solved by technology

The existing problem is: With the rapid development of the lead-free era, the phenolic curing system has gradually replaced the dicyandiamide curing system, and the phenolic curing system can open and crosslink the epoxy group in the epoxy resin to form a network under heating conditions. Structure, this kind of curing agent not only maintains the good adhesion and dielectric properties of epoxy resin, but also has the heat resistance of phenolic resin

However, the laminates produced by the single phenolic curing system are brittle, have low peel strength, and a long lamination time, which is easy to cause thin plates in the PCB manufacturing process.

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