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Anti-evaporation shield jig structure

A technology of anti-evaporation and fixed plate, which is applied in the directions of vacuum evaporation plating, sputtering plating, ion implantation plating, etc. It can solve the problems of poor evaporation effect and plating position deviation, etc., and achieves simple structure and convenient use Effect

Inactive Publication Date: 2014-10-29
天津富可达塑胶制品加工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the evaporation process of mobile phone accessories, such as mobile phone cases, it is necessary to set the mobile phone accessories on the pole and place them in the evaporation equipment to perform the evaporation process through the evaporation equipment. If the mobile phone accessories are offset, it will make The electroplating position is shifted or the evaporation effect is not good. In addition, in the evaporation process, the protection of parts other than the evaporation part is also very important. Therefore, it is necessary to develop a positioning tool to meet the needs of large-scale industrial production

Method used

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  • Anti-evaporation shield jig structure

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Embodiment Construction

[0020] For further illustrating the present invention, now cooperate with accompanying drawing to elaborate:

[0021] Such as Figure 1-4 As shown, the anti-evaporation shielding jig structure is composed of a fixed plate 1 made of PC and a support rod 5. The support rod 5 is provided with a through hole 6 inside, and the middle part of the bottom surface of the fixed plate 1 is provided with a plug-in column 3. The plug post 3 is used in conjunction with the through hole 6 of the support rod 5, so that the fixed plate 1 and the support rod 5 are closely matched and movably connected. The bottom surface of the fixed plate 1 is also provided with four The locking block 4 fixed by the device, the upper surface of the fixed plate 1 is provided with a fixed block 2 for fixing the mobile phone case, the shape of the fixed block 2 corresponds to the shape and size of the mobile phone case to be evaporated, and the side of the fixed block 2 A card slot is provided, and the position ...

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Abstract

The invention provides an anti-evaporation shield jig structure. The jig structure comprises a fixing plate and a support rod, wherein the support rod is internally provided with a through hole, a plug connection post is arranged on the bottom surface of the fixing plate, the plug connection post is used in engagement with the through hole in the support rod, so that the fixing plate is tightly connected with the support rod, locking blocks for fixing with an evaporation device are also arranged on the bottom surface of the fixing plate, the upper surface of the fixing plate is provided with a fixing block for fixing a mobile phone shell, the shape of the fixing block corresponds to the shape and size of the mobile phone shell to be evaporated, a communication hole is formed in a position, connected with the fixing block, of the fixing plate and the height of the edge, where one side of the bottom surface of the fixing plate is located, of the communication hole is higher than the horizontal plane where the bottom surface of the fixing plate is located; by virtue of the anti-evaporation shield jig structure, in an electroplating process, the mobile phone shell does not move, and in an evaporation process, a projecting member on the inner side of the mobile phone shell cannot be polluted or damaged and thus the machining operation is convenient and the operation is more precise.

Description

technical field [0001] The invention relates to the production field of mobile phone accessories, in particular to the anti-evaporation shielding jig structure. Background technique [0002] Vacuum evaporation is the process of heating and plating materials on the substrate in a vacuum environment. Vacuum evaporation is the process of evaporating or sublimating the film-forming substance in a vacuum to precipitate it on the surface of the workpiece or substrate. Thermal evaporation process, the transport of vaporized atoms or molecules between the evaporation source and the substrate, the flight process of some particles in the ambient atmosphere, and the deposition process of vaporized atoms or molecules on the surface of the substrate, that is, vapor condensation, nucleation, and nucleation grow and form a continuous film. The purpose of vacuum evaporation is to coat the substrate with a metal coating to change the surface properties or dimensions of the substrate. Evapo...

Claims

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Application Information

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IPC IPC(8): C23C14/24C23C14/50
Inventor 王昆
Owner 天津富可达塑胶制品加工有限公司