A kind of AC servo driver

Abstract

The invention relates to an alternating current servo driver. The alternating current servo driver comprises a heat emitting component, a power substrate installed on the heat emitting component, a control substrate and an electrolytic capacitor unit. The heat emitting component comprises a bottom board and side frames arranged on the two sides of the bottom board. The power substrate and the control substrate are arranged between the two side frames and are opposite. A capacitor substrate of the electrolytic capacitor unit is arranged between the two side frames, is opposite to the bottom board and is intersected with the plane where the power substrate and the control substrate are located. Compared with the prior art, the electrolytic capacitor unit is suspended on the side frames of the heat emitting component, so that the transverse occupied space of the driver is reduced, and the size of the driver is reduced. Furthermore, the power substrate and the control substrate are arranged at the two ends of the capacitor substrate respectively, insulation between the power substrate and the control substrate is achieved through a capacitor cap assembly, so that the internal structure of the driver is more compact, and the occupied space is reduced.

Description

technical field [0001] The invention relates to a driver, in particular to an AC servo driver. Background technique [0002] The AC servo driver is a driver used to drive the rotation of the servo motor, mainly including heat dissipation components, control substrates, power substrates and capacitor substrates. A capacitor and a capacitor cap are arranged on the capacitor substrate. The capacitor substrate is connected to the power substrate through wires to provide stable electric energy for the power substrate. [0003] Please also see figure 1 and figure 2 ,in, figure 1 is the explosion diagram of the prior art AC servo driver, figure 2 It is a schematic diagram of the installation structure of an AC servo drive in the prior art. In the prior art, the capacitor substrate 1a, the power substrate 2a and the control substrate 3a are stacked on the planar substrate of the heat dissipation component 4a and parallel to it, wherein the power substrate 2a and the control ...

AI Technical Summary

Problems solved by technology

When the heat is dissipated by the fan, the wind force of the fan will act on the heat sink 41a and the power substrate 2a at the same time, and due to the effect of the wind, some dust will be adsorbed to the power substrate 2a in contact with the heat sink, which will cause a short circuit in severe cases and affect the work of the power substrate 2a

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