Device and method for cleaning silicon wafers

Abstract

The invention discloses a device and a method for cleaning silicon wafers. The device comprises an external sink, an internal sink, an ultrasonic / megasonic transducer, an ultrasonic / megasonic generator, a silicon wafer clamp and a threaded rod. The external sink is provided with a drain outlet. The internal sink is disposed in the external sink, a liquid inlet and a liquid outlet are formed in the side wall of the internal sink, and the liquid outlet is disposed in a position, close to the bottom, of the side wall of the internal sink. The ultrasonic / megasonic transducer is arranged at the bottom of the internal sink, and is connected with the ultrasonic / megasonic generator. The silicon wafer clamp clamps a silicon wafer with a to-be-cleaned surface facing the ultrasonic / megasonic transducer. The threaded rod is connected with the silicon wafer clamp and drives the same to move up and down and rotate. During silicon wafer cleaning, the to-be-cleaned surface of the silicon wafer faces the ultrasonic / megasonic transducer and cleaning liquid for cleaning the silicon wafer circulates, thus particles and pollutants in slots and through holes of the silicon wafer can be removed effectively and cleaning effect is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor device manufacturing, in particular to a silicon wafer cleaning device and method. Background technique [0002] Semiconductor devices are formed by forming transistors and interconnection lines on semiconductor silicon wafers through a series of different processing steps. In order for the transistor terminals to be connected to the silicon chip, conductive (such as metal) slots, holes, and other similar structures need to be made in the dielectric material of the silicon chip as part of the semiconductor device. Slots and holes can transfer electrical signals and energy between transistors, internal circuits, and external circuits. [0003] When forming interconnect structures, silicon wafers may require processes such as masking, etching, and deposition to form the electronic circuits required by semiconductor devices. In particular, the multi-layer masking and etching process can patte...

AI Technical Summary

Problems solved by technology

[0004] The existing silicon wafer cleaning device places an ultrasonic or megasonic device at the bottom of the cleaning tank. When cleaning silicon wafers, several silicon wafers are vertically immersed in the cleaning liquid in the cleaning tank. This cleaning method is used to clean patterned silicon wafers. When the chip is used, its cleaning effect is not ideal, especially, when the depth of the groove and the through hole on the silicon wafer is deep, this cleaning method cannot effectively remove the particles and pollutants at the bottom of the groove and the through hole, resulting in the failure of the semiconductor device. Reduced yield and reliability

Images