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OPTICAL WIRING SUBSTRATE, MANUFACTURING METHOD OF the OPTICAL WIRING SUBSTRATE, AND OPTICAL MODULE

A technology for wiring substrates and manufacturing methods, applied in the field of optical wiring substrates, the manufacture of optical wiring substrates, and optical modules, can solve problems such as damage to electronic components, difficulty in dissipating heat, and smaller heat dissipation area of ​​optical wiring substrates, so as to provide heat dissipation performance, easy wiring processing effect

Inactive Publication Date: 2014-11-12
HITACHI METALS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the optical module is miniaturized, the heat dissipation area of ​​the optical wiring board will also be reduced, and the heat generated from the electronic components mounted on the optical wiring board will not be easily dissipated.
Electronic components may be damaged due to temperature rise in the optical module

Method used

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  • OPTICAL WIRING SUBSTRATE, MANUFACTURING METHOD OF the OPTICAL WIRING SUBSTRATE, AND OPTICAL MODULE
  • OPTICAL WIRING SUBSTRATE, MANUFACTURING METHOD OF the OPTICAL WIRING SUBSTRATE, AND OPTICAL MODULE
  • OPTICAL WIRING SUBSTRATE, MANUFACTURING METHOD OF the OPTICAL WIRING SUBSTRATE, AND OPTICAL MODULE

Examples

Experimental program
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Effect test

Embodiment approach

[0063] According to the first embodiment described above, the following operations and effects are obtained.

[0064] Since the plurality of through holes 6 formed in the optical wiring substrate 3 are arranged, in a plan view viewed from the mounting surface 3a side of the optical wiring substrate 3, at least a part of the bottom surface 60b is connected to the photoelectric conversion element mounted on the first conductor layer 31 The arrangement positions of the pads 11 (the first pad 111, the second pad 112, and the third pad 113) and the pad 121 of the semiconductor circuit element 12 overlap. Therefore, the photoelectric conversion can be converted from the photoelectric through the through hole 6 The heat generated by the element 11 and the semiconductor circuit element 12 is transferred to the second conductor layer 32 to be dissipated. In addition, the wiring process from the first conductor layer 31 to the second conductor layer 32 via the via hole 6 becomes easy.

[00...

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Abstract

An optical wiring substrate includes a first conductor layer including a metal, a second conductor layer including a metal and arranged parallel to the first conductor layer, an insulation layer disposed to insulate the first conductor layer from the second conductor layer, and an electronic component including a photoelectric conversion element mounted on the substrate, and a via hole formed in the second conductor layer and the insulation layer so as to pass through the second conductor layer and the insulation layer in a thickness direction thereof, the via hole including an inner surface plated with a metal. The via hole is configured such that at least a part of a bottom surface thereof blocked by the first conductor layer is arranged in a plan view so as to overlap with an arrangement position of a pad of the electronic component that is mounted on the first conductor layer.

Description

Technical field [0001] The present invention relates to an optical wiring substrate formed with a wiring pattern, a method of manufacturing the same, and an optical module having the optical wiring substrate. Background technique [0002] Conventionally, there is known an optical module in which electrical wiring is patterned and a photoelectric conversion element is mounted (for example, refer to Patent Document 1). [0003] The optical module described in Patent Document 1 includes: a substrate composed of an insulating resin layer and a metal layer formed on the surface of the insulating resin layer; a photoelectric conversion element that is flip-chip mounted on the substrate; and a semiconductor circuit The element is connected to the substrate by wire bonding; the optical waveguide is optically connected to the optical fiber; the optical signal path conversion member is formed with a reflection surface that reflects the light propagating inside the optical fiber and the optic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42
CPCH01L23/5226H01L21/76877H01L2224/16225G02B6/428G02B6/4214G02B6/4268H05K1/0206H05K1/0274H05K2201/10121
Inventor 安田裕纪平野光树石川浩史
Owner HITACHI METALS LTD