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Rapid processing method of smart bus card shell

A technology of an intelligent bus card and a processing method, which is applied in the field of mobile communication, can solve the problems of bus IC card shell breakage, small bus IC card size, chip damage, etc., achieves good tightness, avoids metal fatigue, and prevents chip damaged effect

Inactive Publication Date: 2017-02-15
MIANYANG MIANZHOUTONG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When most passengers use bus IC cards, they usually carry them with them and put them in their trouser pockets or wallets for easy use; however, due to their small size and thin thickness, bus IC cards are easy to lose or be bent when carrying them. , which in turn causes the bus IC card shell to break and the chip in the card to be damaged

Method used

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  • Rapid processing method of smart bus card shell

Examples

Experimental program
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Effect test

Embodiment 1

[0025] Such as figure 1 As shown, this embodiment includes the following steps:

[0026] (A) forming an upper shell 1 and a lower shell 2 capable of engaging with each other by injection molding in a mold;

[0027] (B) A support body 6 is fixedly installed in the lower case 2, and a chip 3 is placed in the support body 6, and fillers 5 are arranged around the support body 6, and the chip 3 is placed in the center of the lower case 2;

[0028] (C) A V-shaped metal frame 7 is hingedly connected to the upper and lower ends of the support body 6 respectively, and there are gaps between the movable ends of the V-shaped metal frame 7 and the upper shell 1 and the lower shell 2 respectively;

[0029] (D) The upper case 1 and the lower case 2 are connected and matched by the rubber block 4, and then the upper case 1 and the lower case 2 are bonded and sealed by an adhesive.

[0030] The work of the present invention is an improvement to the existing bus IC card shell, and the upper ...

Embodiment 2

[0033] Such as figure 1 As shown, this embodiment is based on Embodiment 1. In step (C), the two V-shaped metal frames 7 are arranged symmetrically on the top and bottom surfaces of the support body 6 along the center of the support body 6 . Two V-shaped metal frames 7 are symmetrically arranged on the support body 6 along the center of the support body 6, so that no matter whether the front or back of the IC card or the left end or the right end is subjected to external force, the V-shaped metal frame 7 can make the same direction. deformation response to reduce the degree of distortion of the card surface and avoid damage to the chip 3 located in the support body 6 .

[0034] Preferably, the filler 5 is foamed plastic. The foamed plastic is light in weight and has good tightness. When it is filled into the cavity together with the V-shaped metal frame 7, it can ensure that the V-shaped metal frame 7 is provided with a certain support, and at the same time, it can also make ...

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Abstract

The invention discloses a method for quickly processing an intelligent bus card shell. The method includes the following steps that (A) an upper shell body and a lower shell body which can be meshed with each other are formed in a die in an injection molding mode; (B) a support is fixedly mounted in the lower shell body, a chip is placed in the support, filler is arranged around the support, and the chip is placed at the center of the lower shell body; (C) V-shaped metal racks are hinged to the upper end and the lower end of the support respectively, and gaps are reserved between the moving end of one V-shaped metal rack and the upper shell body and between the moving end of the other V-shaped metal rack and the lower shell body respectively; (D) the upper shell body and the lower shell body are connected and matched through a rubber block, and then the upper shell body and the lower shell body are bonded and sealed through adhesives. The two moving ends of the V-shaped metal racks are deformed around hinged points on the support in the stress direction, the entire card face distortion caused by external force can be lightened, and therefore the phenomenon that an IC card is excessively distorted so that the chip can be damaged is avoided.

Description

technical field [0001] The invention relates to the field of mobile communication, in particular to a rapid processing method for a housing of an intelligent bus card. Background technique [0002] IC card refers to integrated circuit card. The bus card we generally use is a kind of IC card. Generally, common IC cards use radio frequency technology to communicate with IC card readers. There is a difference between IC cards and magnetic cards. The card stores information through the integrated circuit in the card, while the magnetic card records information through the magnetic force in the card. The cost of the IC card is generally higher than that of the magnetic card, but the confidentiality is better. The bus IC card is a non-contact data card, it is through the chip integrated in the card through the inductance coil on the card (the inductance coil is also a coil made of copper wire) at both ends of the coil through various The function of the circuit makes the induced ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/06H05K5/02
Inventor 李强李宝家
Owner MIANYANG MIANZHOUTONG
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