Manufacturing method for bend-resistant bus card casing

A manufacturing method and technology for a bus card, applied in the field of mobile communications, can solve the problems of chip damage, being bent, easy to lose, etc., and achieve the effects of improving buffer protection, slowing down distortion, and preventing chip damage

Inactive Publication Date: 2014-11-26
MIANYANG MIANZHOUTONG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When most passengers use bus IC cards, they usually carry them with them and put them in their trouser pockets or wallets for easy use; however, due to their small size and thin thickness, bus IC cards are easy to lose or be bent when carrying them. , which in turn causes the bus IC card shell to break and the chip in the card to be damaged

Method used

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  • Manufacturing method for bend-resistant bus card casing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Such as figure 1 As shown, this embodiment includes the following steps:

[0025] (A) forming an upper shell 1 and a lower shell 2 capable of engaging with each other by injection molding in a mold;

[0026] (B) installing a filler 5 in the lower case 2, and placing the chip 3 at the center of the lower case 2;

[0027] (C) The upper case 1 and the lower case 2 are connected and matched by the rubber block 4, and then the upper case 1 and the lower case 2 are bonded and sealed by an adhesive.

[0028] In the above steps, the upper casing 1 and the lower casing 2 are connected to each other through rubber blocks 4 to form a closed cavity, and a chip 3 is fixed in the cavity, and a filler 5 is provided between the chip 3 and the cavity, Two elastic connecting portions 6 are provided on the outer walls of the upper casing 1 and the lower casing 2 respectively, and the width of the connecting portions 6 is 1 / 4 of the total width of the upper casing 1 . The work of the pr...

Embodiment 2

[0031] Such as figure 1 As shown, in this embodiment, on the basis of Embodiment 1, the four connecting parts 6 are arranged symmetrically on the outer walls of the upper casing 1 and the lower casing 2 centering on the cavity. Four elastic connecting parts 6 are symmetrically distributed in pairs on the upper casing 1 and the lower casing 2. When the surface of the IC card is impacted by an external force, the elastic recovery of the connecting parts 6 can be superimposed to the maximum, and the direction is consistent with the direction of the external force. On the contrary, to the greatest extent offset the distortion caused by the external force acting on the card surface.

[0032] Preferably, the cross section of the connecting portion 6 is wavy. The connection portion 6 with a wavy cross section can generate a relatively large amount of deformation per unit area, which can further improve the buffer protection of the upper shell 1 and the lower shell 2 .

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Abstract

The invention discloses a manufacturing method for a bend-resistant bus card casing. The method comprises the following steps: (A) forming an upper casing body and a lower casing body capable of being meshed with each other through mould injection in a mould; (B) installing a filler in the lower casing body, and arranging a chip at the central position of the lower casing body; (C) connecting the upper casing body and the lower casing body through a rubber block in a matched mode, and sealing the upper casing body and the lower casing body through adhesive in an adhesion mode. When an IC card bears external force which is in the direction perpendicular to the card face or forms a certain angle with the card face and is about to deform, two elastic connection portions respectively arranged on the outer wall of the upper casing body and the outer wall of the lower casing body can deform together in the direction of the external force to reduce distorsion of the whole card face caused by the external force. The rubber block located between the upper casing body and the lower casing body bears the force and compresses at the same time and reduces distortion intensity caused by the external force to the card face to the lowest degree with the aid of the elastic connection portions in the deformation recovering process, and the chip is further prevented from being damaged due to over distortion of the IC card.

Description

technical field [0001] The invention relates to the field of mobile communication, in particular to a method for manufacturing a bending-resistant bus card shell. Background technique [0002] IC card refers to integrated circuit card. The bus card we generally use is a kind of IC card. Generally, common IC cards use radio frequency technology to communicate with IC card readers. There is a difference between IC cards and magnetic cards. The card stores information through the integrated circuit in the card, while the magnetic card records information through the magnetic force in the card. The cost of the IC card is generally higher than that of the magnetic card, but the confidentiality is better. The bus IC card is a non-contact data card, it is through the chip integrated in the card through the inductance coil on the card (the inductance coil is also a coil made of copper wire) at both ends of the coil through various The function of the circuit makes the induced curre...

Claims

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Application Information

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IPC IPC(8): H05K5/06H05K5/02
Inventor 李强李宝家
Owner MIANYANG MIANZHOUTONG
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