Silicon-based mems array thruster and preparation method thereof
An array type, thruster technology, applied in the field of micro-propulsion technology and micro-electromechanical systems, can solve problems such as failure of igniter breakage, and achieve the effects of improving yield, avoiding breakage of igniter, and improving production efficiency
Inactive Publication Date: 2016-08-24
NORTHWESTERN POLYTECHNICAL UNIV
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Problems solved by technology
[0005] The purpose of the present invention is: in order to overcome the problem of igniter fracture and failure caused by the high bonding temperature of the existing micro propulsion technology, the present invention proposes a MEMS array propeller formed only by silicon material
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[0023] refer to Figure 1-2 , the silicon-based MEMS array propeller in this embodiment includes a nozzle 1, an ignition resistor 2, an ignition wire 3 and a pad 4; the thickness of the silicon-based material is 500 μm; the upper surface of the propeller is concaved to form a nozzle 2 The nozzle 2 is a circle with a diameter of 1000 μm; the lower surface of the propeller is sputtered with an ignition resistor 2, an ignition wire 3 and a welding pad 4; the ignition resistor 2 is composed of two parallel serpentine folded metal gold film resistors; The width and thickness are 50 μm and 300 nm respectively; each ignition resistor 2 corresponds to the position of each nozzle 1; the ignition resistor 2 is connected to the ignition wire 3; the width and thickness of the ignition wire 3 are 100 μm and 300 nm respectively; the ignition wire 3 and the pad 4 connections; the area and thickness of pad 4 are 0.5mm 2 , 300nm.
[0024] When working, the ignition resistor 2 is energized th...
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Abstract
The invention discloses a silicon-based MEMS array thruster and a preparation method thereof, belonging to the field of micro-propulsion technology. The thruster mainly includes the nozzle array part and the circuit part respectively located on the upper and lower surfaces of the silicon chip; It consists of an array of ignition resistors 2 sputtered on the surface, ignition wires 3 and welding pads 4, and each ignition resistor 2 corresponds to the position of each nozzle 1. At the same time, the invention discloses a bonding-free process method for preparing the silicon-based MEMS array thruster. The beneficial effect of the present invention is: the nozzle and the ignition resistor are integrated on the upper and lower surfaces of the silicon material, avoiding the process of bonding and assembling of the original MEMS thruster, and greatly improving the production efficiency of the thruster; The different thermal expansion coefficients of the layer and the ignition circuit lead to the breakage and failure of the igniter, which improves the yield.
Description
[0001] Field: [0002] The invention relates to a silicon-based MEMS array thruster and a preparation method thereof, which are used for position maintenance, attitude control and orbit adjustment of pico-satellites, and belong to the field of micro-propulsion technology and micro-electromechanical systems (MEMS). Background technique: [0003] The propulsion system is a key subsystem of most spacecraft, mainly used for position keeping, attitude control, gravitational compensation and orbit adjustment of the spacecraft. With the continuous maturity of micro-spacecraft, such as micro-satellites, nano-satellites, and pico-satellites, if micro-spacecraft are required to complete certain special tasks, such as satellite formation flight, these micro-spacecraft need to be equipped with propulsion systems. Because the traditional propulsion system is relatively large in size and mass, it cannot be applied to micro-spacecraft. Therefore, there is an urgent need for a micro-propulsio...
Claims
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IPC IPC(8): F02K9/42
Inventor 苑伟政谢建兵申强屈贝妮常洪龙
Owner NORTHWESTERN POLYTECHNICAL UNIV