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Ultrasound Matrix Array Probe with Thermally Dissipated Cables

A probe and cable technology, used in the field of medical diagnostic ultrasound systems, can solve problems such as heat dissipation and performance degradation

Active Publication Date: 2020-11-03
KONINKLJIJKE PHILIPS NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even such improved passive cooling cannot completely dissipate all the heat generated by the integrated circuit, thereby degrading performance as mentioned above in order to stay below the thermal limit

Method used

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  • Ultrasound Matrix Array Probe with Thermally Dissipated Cables
  • Ultrasound Matrix Array Probe with Thermally Dissipated Cables
  • Ultrasound Matrix Array Probe with Thermally Dissipated Cables

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Embodiment Construction

[0018] see first figure 1 , schematically illustrates an acoustic stack 100 with thermally conductive pads constructed in accordance with the principles of the present invention. The piezoelectric layer 110 (such as PZT) and the two matching layers 120, 130 bonded to the piezoelectric layer are cut through the incision 75 to form an array 170 of individual transducer elements 175, figure 1 Four transducer elements 175 are visible. Transducer array 170 may include a single row of transducer elements (1-D array), or a piezoelectric plate cut in two orthogonal directions to form a two-dimensional (2D) matrix array of transducer elements. Matrix array 170 may also include a one-dimensional or two-dimensional array of micromachined ultrasonic transducers (MUTs) formed on a semiconductor substrate by semiconductor processing. Matching layers match the acoustic impedance of the piezoelectric material to that of the body being diagnosed, usually in steps of progressive matching laye...

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PUM

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Abstract

A matrix array probe including a transducer array and integrated circuits coupled to the transducer elements dissipates heat generated by the array and integrated circuits through a housing of the transducer probe. A pump in the probe connector pumps fluid through a closed loop system including incoming and outgoing fluid conduits in the cable. The fluid conduits in the cable are separated by the cable electrical conductors of the probe. Heat transfer in the probe is achieved through heat exchangers in the probe space frame or transducer stack inserts and a Peltier arrangement may be used. Additional cooling may also be provided by metal-to-metal contact with coolers in the ultrasound system.

Description

[0001] field of invention [0002] The present invention relates to medical diagnostic ultrasound systems, and in particular to ultrasound matrix array probes that dissipate heat generated by the probe ASIC through the probe cables. Background technique [0003] In ultrasound imaging, a two-dimensional array of transducers is used for three-dimensional scanning. A two-dimensional array has many rows and columns of transducer elements in both azimuthal and vertical directions, which would require a large number of cable conductors to couple signals between the probe and the host ultrasound system. A preferred technique for minimizing the number of signal conductors in the probe cable is to perform at least some beamforming in the probe in a microbeamformer ASIC (Application Specific Integrated Circuit). This technique requires only a relatively small number of partially beamformed signals to be coupled to the host ultrasound system, reducing the number of signal conductors nee...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G10K11/00A61B8/00
CPCA61B8/4444A61B8/4488A61B8/546G10K11/004A61B8/4494A61B2018/00023G01S7/52079
Inventor R·E·戴维森M·斯卡尔塞拉J·C·泰勒A·L·鲁滨逊
Owner KONINKLJIJKE PHILIPS NV
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