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Wafer thickness measuring device applied to sapphire thinning device

A wafer and sapphire technology, applied in the field of wafer thickness measuring devices, can solve problems such as non-compliance, complicated measurement process, and insufficient measurement accuracy, and achieve reliable work, high measurement accuracy, and low measurement accuracy.

Active Publication Date: 2014-12-17
JIANGSU POLYTECHNIC COLLEGE OF AGRI & FORESTRY
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the field of sapphire processing, wafer thickness measurement is one of the most important branches, and wafer thinning equipment is the core processing equipment of the production line. The needs of modern production technology

Method used

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  • Wafer thickness measuring device applied to sapphire thinning device
  • Wafer thickness measuring device applied to sapphire thinning device
  • Wafer thickness measuring device applied to sapphire thinning device

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Embodiment Construction

[0018] The technical solution of the present invention will be described in detail below in conjunction with the drawings.

[0019] Such as Figure 1 to Figure 3 As shown, a wafer thickness measurement device applied to sapphire thinning equipment of the present invention includes a cylinder actuator, a controller (PLC) connected to the cylinder actuator, and performs between the cylinder actuator and the controller. The communication module for data transmission and the human-computer interaction interface. The cylinder actuator includes an SMC sliding table cylinder 3, a contact displacement sensor fixed to the SMC sliding table cylinder 3 through a fixed block, and the contact displacement sensor is provided with a main probe 1 and an extension Probe 2, the contact type displacement sensor transmits the measured data information to the controller through the communication module, and the controller compares the received data information with the target data and judges whether ...

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Abstract

The invention discloses a wafer thickness measuring device applied to a sapphire thinning device. The device comprises a cylinder executing mechanism, a controller connected with the cylinder executing mechanism, a communication module for transmitting data between the cylinder executing mechanism and the controller, and a human-computer interaction interface; the cylinder executing mechanism comprises an SMC (Sheet Molding Compound) sliding platform cylinder, and a contact type displacement sensor which is fixed to the SMC sliding platform cylinder through a fixing block; the contact type displacement sensor is equipped with a main probe and an expanding probe and used for transmitting the measured data information to a controller; the controller is used for comparing the received data information with the target data, and determining whether the processing is accurately done; the data transmission is performed between the human-computer interaction interface and the controller. The wafer thickness measuring device applied to the sapphire thinning device is on the basis of the PLC arrangement; the measurement precision is high; the stability is high; an automatic measuring device widely applies; in addition, the operation is simple and convenient.

Description

Technical field [0001] The invention relates to a measuring device, in particular to a wafer thickness measuring device applied to sapphire thinning equipment. Background technique [0002] In the field of automation control and measurement, controllers (PLC) and displacement sensors are widely used in industrial production, and with the development of modern industries, they play an increasingly important role. As we all know, wafers are widely used in lighting, home appliances , Environmental protection and other fields. [0003] In the field of sapphire processing, wafer thickness measurement is one of the most important branches, and wafer thinning equipment is the core processing equipment of the production line. The existing measurement equipment either has insufficient measurement accuracy or the measurement process is complex and does not meet the requirements. The demand of modern production technology. Therefore, there is an urgent need for a wafer thickness measurement...

Claims

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Application Information

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IPC IPC(8): G01B11/06
Inventor 李娜李红许评邵西河
Owner JIANGSU POLYTECHNIC COLLEGE OF AGRI & FORESTRY
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