Method for forming plated-through hole in PTFE circuit board

Abstract

The invention relates to the technical field of circuit board production, in particular to a method for forming a plated-through hole in a PTFE circuit board. The method comprises the processes of inner layer circuit manufacturing, pressing, drilling, copper deposition, whole board electroplating and the like, and moreover when an inner layer circuit is manufactured, copper embedded positions are manufactured on the periphery of the position which is used for forming the plated-through hole. According to the method for forming the plated-through hole in the PTEF circuit board, when an inner layer circuit is manufactured, the copper embedded positions are manufactured simultaneously, after a multilayer pressing board is formed by pressing and is drilled, the hole of the plated-through hole is to be manufactured, the copper embedded positions are arranged on the periphery of the plated-through hole, and the wall of the hole is equal to be provided with copper in an embedded mode. Electroplating copper which is formed through copper deposition and whole board electroplating is not only combined with a PTFE base material of the wall of the hole but also combined with the copper of the copper embedded positions, so that the binding force of the electroplating copper and the wall of the hole is improved, and disengaging of the electroplating copper from the wall of the hole is prevented. Even though the hole depth of the plated-through hole is larger than 1 mm, it can be still guaranteed that the electroplating copper of the wall of the hole is not disengaged.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for making metallized holes on a PTFE circuit board. Background technique [0002] The circuit board is the support of electronic components and provides electrical connections for electronic components. The production process of the circuit board is generally: cutting → inner layer pattern transfer → inner layer etching → lamination → drilling → sinking copper → full board electroplating → outer layer pattern transfer → pattern electroplating → etching → solder mask → surface treatment → Molding processing. The production of metallized holes on the circuit board is to drill holes on the multi-layer laminated board, then form a layer of electroplated copper on the hole wall through the copper sinking process, and then thicken the electroplated copper on the hole wall through the full board electroplating process. In addition, in order to enhance the bo...

AI Technical Summary

Problems solved by technology

However, for PTFE (polytetrafluoroethylene) circuit boards, due to the strong inertia of PTFE materials, the bonding force between PTFE substrate and electroplated copper is poor. When the hole depth of the metallized hole to be made is greater than 1mm, electroplated copper It is extremely difficult to tightly bond with the PTFE substrate of the hole wall, and it is easy to cause electroplating copper to detach

Even after the plasma activation treatment of the existing process, in the subsequent processing, after being etched by the chemical solution, there will still be a phenomenon that the electroplated copper will separate from the PTFE substrate, which will affect the quality of the circuit board

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