Flexible metal clad laminate

A flexible metal and metal layer technology, applied in the direction of metal layered products, layered products, synthetic resin layered products, etc., can solve the problems of solder resistance and other problems

Active Publication Date: 2014-12-24
NEXFLEX CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Patent Document 1 exemplifies the case of using a polyimide resin having a special structure as a thermoplastic polyimide resin layer as a known technique. or higher severe conditions, solder resistance will be problematic

Method used

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Examples

Experimental program
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Effect test

preparation example Construction

[0095] Under the same preparation conditions as in Synthesis Example 1, preparation was carried out according to the components and contents described in [Table 1].

[0096] Table 1

[0097] [Table 1]

[0098]

[0099] *E' at 300°C: Storage heat at 300°C

[0100] *E' at 350°C: Storage heat at 350°C

[0101] *CTE: Coefficient of linear thermal expansion measured in the range of 100°C to 200°C

[0102] *Tg: glass transition temperature

Embodiment 1

[0104] The polyamic acid solution prepared by [Synthesis Example 2] was applied on a 12 μm thick electrolytic copper foil (F2WS copper foil made of Furukawa circuit foil, roughness Rz = 2.0 μm), which was then heated at 140° C. dried to form a first polyimide precursor layer. The polyamic acid solution prepared by [Synthesis Example 1] was applied on one side of the first polyimide precursor layer, which was then dried at 140° C. to form a second polyimide precursor layer. After that, the polyamic acid solution prepared by [Synthesis Example 2] was applied on one side of the second polyimide precursor layer, and then dried at 140° C. to form a third polyimide precursor Floor. Under a nitrogen atmosphere, the fabricated laminate was heated from 150°C to 385°C for 9 minutes. After curing, the thickness of each of the first polyimide precursor layer, the second polyimide precursor layer and the third polyimide precursor layer reached 2.5 μm, 14 μm and 3 μm, respectively. The p...

Embodiment 2

[0106] By the same method as in Example 1, a flexible metal-clad laminate was produced according to the layer structure in [Table 2].

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Abstract

Provided is a flexible metal clad laminate, in which a metal layer is formed on one surface or both surfaces of an insulating layer constituted by a plurality of polyimide-based resin layers, and the polyimide-based resin layers that are in contact with the metal layer have Storage Modulus of 1 X 108 Pa or more at 300 DEG C and 1 X 108 Pa or less at 350 DEG C, and has characteristics in that curling of a product does not occur, adhesive strength with a metal clad is favorable, a dimensional change after heat treatment is small, and particularly solder resistance after moisture absorption is excellent.

Description

technical field [0001] The present invention relates to a flexible metal-clad laminate for the manufacture of flexible printed circuit boards, and is characterized in that the product does not undergo curling, has favorable adhesive strength to the metal cladding, has little dimensional change after heat treatment, and is especially resistant to moisture absorption. Excellent weldability. Background technique [0002] Flexible metal-clad laminates for manufacturing flexible printed circuit boards are laminates of conductive metal cladding and insulating resin, which can withstand fine circuit processing and can be bent in a narrow space, so as electronic equipment size and There is a trend towards weight reduction, and its utilization is increasing day by day. Flexible metal-clad laminates are classified into two-layer type and three-layer type, and the problem of the three-layer type using an adhesive is that it has lower heat resistance and flame retardancy compared to th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B32B27/06C08G73/10
CPCC08G73/1046C08G73/1078B32B15/08B32B27/06C08G73/10
Inventor 金大年金哲镐鞠承定崔元重李庸石
Owner NEXFLEX CO LTD
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