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Base plate for PCB drilling and manufacturing method of base plate for PCB drilling

A manufacturing method and backing board technology, applied in chemical instruments and methods, applications, household appliances, etc., can solve problems such as PCB board warping, PCB board scrapping, board layering, etc.

Active Publication Date: 2015-01-07
烟台柳鑫新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a backing plate for PCB drilling and a manufacturing method thereof, aiming at solving the problem that the backing plate for drilling in the prior art is often used for PCB drilling. The PCB board is warped and the board is delaminated, which leads to the scrapping of the PCB board

Method used

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  • Base plate for PCB drilling and manufacturing method of base plate for PCB drilling
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  • Base plate for PCB drilling and manufacturing method of base plate for PCB drilling

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Embodiment Construction

[0030] In order to make the object, technical solution and advantages of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0031] The invention provides a backing plate for PCB drilling, such as figure 1 As shown, the backing plate includes: a foam core material layer 1 and a first hardness panel layer 2 and a second hardness panel layer 3 respectively arranged on the upper surface and the lower surface of the foam core material layer.

[0032] like figure 1 As shown, the pad is designed with the foam core material as the middle material layer and the hardness panel as the surface material layer.

[0033] Specifically, the materials used for the first and second hardness panel layers are high-hardness mate...

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Abstract

The invention provides a base plate for PCB drilling and a manufacturing method of the base plate for the PCB drilling. The base plate comprises a foamed core material layer, and a first hardness panel layer and a second hardness panel layer which are respectively arranged on the upper surface and the lower surface of the foamed core material layer. According to hardness panels, the flash of an opening can be well inhibited, and because the foamed core material layer is arranged in the middle of the base plate, a foam interlayer of the base plate has the certain compressive strength, so that a PCB can be prevented from generating slight deformation due to pressing in the drilling process, the plate can be easily cut into powder by a drill bit, drilling cuttings adhered to the drill bit are thrown out, an effect of cleaning the drill bit is achieved, and a support is provided for forming relatively high-quality drill holes.

Description

technical field [0001] The invention relates to the technical field of PCB processing and manufacturing, in particular to a backing plate for PCB drilling and a manufacturing method thereof. Background technique [0002] The backing board for PCB drilling is an important auxiliary material in the field of PCB production. The backing boards currently used in the market are mainly thermoformed resin-impregnated laminates or composite wood backing boards. [0003] The above-mentioned backing plate in the prior art often has defects such as warping of the product and layering of the plate when the PCB is drilled, and such a laminate will generate a large amount of powder during the drilling process, which will bond the PCB itself to produce Drilling chips such as resin shavings, glass fiber shavings, and copper shavings are attached to the drill bit, blocking the chip removal groove of the drill needle, making the chip removal poor, resulting in greater wear of the drill needle,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B3/12B32B29/06B32B27/04B32B27/02B32B27/34B32B29/02B32B7/12B32B37/12B32B37/10
CPCB32B5/18B32B27/10B32B2255/12B32B2255/26B32B2260/028B32B2260/046B32B2307/54B32B2457/08
Inventor 欧亚周杨柳张伦强刘飞
Owner 烟台柳鑫新材料科技有限公司
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