Device for measuring heat conductivity coefficient of liquid on basis of transient plane source method
A technology of transient plane and thermal conductivity, applied in the direction of material resistance, etc., can solve the problems of high liquid thermal conductivity measurement results and increased data dispersion rate, and achieve the effects of suppressing natural convection, high output power, and high reliability
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specific Embodiment approach 1
[0017] Specific Embodiment 1: This embodiment is a device for measuring liquid thermal conductivity based on the transient plane heat source method, including a computer 1, a sample holder 2, a valve 3, a sample chamber 4, a solid standard sample 5, a probe 6, and a gasket 7 , aluminum alloy 8 and liquid injector 9, liquid pool 12, first plastic tube 13 and second plastic tube 14;
[0018] The sample chamber 4 is provided with a sample holder 2, and the aluminum alloy 8 is arranged on the sample holder 2; the upper end of the aluminum alloy 8 is provided with a liquid pool 12; the two ends of the liquid pool 12 are provided with a first small hole on the wall of the pool 10 and the second small hole 11; one end of the first plastic tube 13 communicates with the first small hole 10, and the other end of the first plastic tube 13 communicates with the valve 3; one end of the second plastic tube 14 communicates with the second small hole 11 is connected, and the other end of the ...
specific Embodiment approach 2
[0028] Embodiment 2: The difference between this embodiment and Embodiment 2 is that the length of the groove with a depth of 25 μm is equal to the length of the probe 6 . Other steps are the same as in the second embodiment.
specific Embodiment approach 3
[0029] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the tip of the probe 6 is above the center of the liquid pool 12 . Other steps are the same as those in Embodiment 1 or 2.
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