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Ultra-small diamond type rectifier bridge adhesive assembly machine

A rectifier bridge, ultra-small technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of inaccessibility and complexity of the dispensing needle plate, achieve low manufacturing cost, improve accuracy, and simple and compact structure Effect

Active Publication Date: 2015-01-07
安徽旭特电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing rectifier bridge viscose assembly machine cannot make the dispensing needle plate reach any position on the base, so that the welding process between the die and the chip can only be: sucking the lower solder piece, sucking the crystal grain, sucking the upper layer solder piece, It is very complicated to pre-solder the frame in the furnace, install the pre-soldered chips, and enter the furnace for welding.

Method used

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  • Ultra-small diamond type rectifier bridge adhesive assembly machine
  • Ultra-small diamond type rectifier bridge adhesive assembly machine
  • Ultra-small diamond type rectifier bridge adhesive assembly machine

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Embodiment Construction

[0014] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0015] An ultra-small block rectifier bridge glue assembly machine, such as Figure 1 to Figure 5 As shown, including the base 28, the upper side of the base 28 is provided with two sliding rails 11 in parallel, the sliding block 12 is installed on the sliding rail 11, the second nut 9 is installed on one side of the sliding block 12, and the second step is installed on the end of the sliding block 11. Into the motor 31, the second screw mandrel 10 is installed on the output shaft of the second stepper motor 31, the second screw mandrel 10 cooperates with the second nut 9, the bracket 8 is installed on the slider 12, and the upper slide rail 2 is installed on the bra...

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Abstract

The invention discloses an ultra-small diamond type rectifier bridge adhesive assembly machine which comprises a base. Two lower sliding rails are arranged on the upper side of the base in parallel. Sliding blocks are installed on the lower sliding rails. One side of each sliding block is provided with a second nut. One end of each lower sliding rail is provided with a second stepping motor. An output shaft of each second stepping motor is provided with a second screw rod matched with the corresponding second nut. Each sliding block is provided with a support. The second stepping motors enable the sliding blocks to move along the lower sliding rails through cooperation between the second screw rods and the second nuts, a first stepping motor enables a fixing sleeve to slide along an upper sliding rail through a first screw rod and a first nut, and accordingly an adhesive dispensing needle plate can reach any position of the base, the welding process of crystal grains and chips is changed to be the processes of placing a lower framework, pasting solder paste to crystal grains, placing an upper framework, feeding and welding, and the working procedure is simple. A push rod motor can drive the adhesive dispensing needle plate to ascend and descend, and therefore the adhesive dispensing needle plate can achieve the processes of pasting of solder paste, pasting of crystal grains and the like.

Description

technical field [0001] The invention relates to an assembly machine, in particular to an ultra-small block type rectifier bridge viscose assembly machine. Background technique [0002] The rectifier bridge glue assembly machine is a device used to join the die and the chip together. At present, similar products on the market use solder tabs and die filling processes. It is necessary to use a suction cup to absorb the solder tabs and dies, and then use a suction pen to transfer them to the On the lead frame, the efficiency is lower. The existing rectifier bridge viscose assembly machine cannot make the dispensing needle plate reach any position on the base, so that the welding process between the die and the chip can only be: sucking the lower solder piece, sucking the crystal grain, sucking the upper layer solder piece, It is very complicated to pre-solder the frame in the furnace, install the pre-soldered chips, and enter the furnace for welding. Contents of the inventio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67
Inventor 徐建
Owner 安徽旭特电子科技有限公司
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