Method of fabricating sputtering target, sputtering target using the method, and method of manufacturing organic light-emitting display apparatus using the sputtering target
By mixing materials such as tin oxide and carbon in the sputtering target, and compressing and sintering in a reducing atmosphere, a low-resistance sputtering target is formed, which solves the problem of excessive resistance when depositing insulating inorganic materials by sputtering and achieves Efficient thin film packaging for organic light-emitting display devices.
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[0032] The present invention will be described more fully hereinafter with reference to the accompanying drawings, in which various embodiments are shown. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like reference numerals refer to like elements throughout.
[0033] It will be understood that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements may be present therebetween. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present.
[0034] It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, compone...
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