Method for manufacturing epitaxial structure with reusable substrate

Abstract

The invention discloses a method for manufacturing an epitaxial structure with a reusable substrate. The method comprises the steps of (1) forming a buffer layer, a substrate protection layer, an epitaxial stripping layer, an epitaxial protection layer and an epitaxial light emitting structure at the surface of an epitaxial substrate orderly from bottom to top, (2) carrying out oxidation on the epitaxial stripping layer to form an oxidation stripping layer, (3) carrying out evaporation of metal reflective layer on the second type current expansion layer of the epitaxial light emitting structure, and bonding the metal reflective layer and a substrate, (4) using strong alkali to corrode the oxidation stripping layer and using the corrosion device with a rotation function to corrode the oxidation stripping layer until the epitaxial light emitting structure and the epitaxial substrate are separated to obtain the epitaxial substrate which can be reused. According to the method, the epitaxial layer damage problem caused by stripping a diode can be solved, the substrate can be reused, and the cost is saved.

Description

technical field [0001] The invention relates to the technical field of light-emitting diodes, in particular to a manufacturing method of an epitaxial structure with a reusable substrate. Background technique [0002] Light-emitting diodes (LEDs) have the advantages of low power consumption, small size and high reliability. As the main light source, they have been developed rapidly. Especially in recent years, the application fields of light-emitting diodes have expanded rapidly. , and the cost is lower. [0003] In the prior art, higher luminous intensity can be obtained by using the chip manufacturing process of the inverted light-emitting diode, but the manufacturing cost of this structure is high. Currently, reducing the cost of the inverted structure chip is mainly achieved by reducing the price of raw materials and increasing the yield. The method of reducing the price of raw materials to reduce the production cost is relatively limited, and the method of producing lig...

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Problems solved by technology

[0004] In the prior art, due to the slow rate of stripping and the low success rate of maintaining the integrity of the epitaxial light-emitting structure after stripping, the substrate of the inverted light-emitting diode is generally removed by etching or grinding, which wastes the epitaxial light-emitting structure. Substrate and aggravated the pollution of the environment during the manufacturing process

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