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A plate used for a probe card, a manufacturing method thereof and the probe card

A technology of probe card and ceramic board, which is applied in the field of probe card board and its manufacture and probe card, can solve difficult problems such as power noise, and achieve superior durability and noise reduction efficiency

Active Publication Date: 2015-02-11
塞姆西恩有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In boards of highly integrated probe cards used to inspect highly integrated wafers, power noise problems have arisen to the point of excess due to the increase in current levels required to evaluate an operation, and in current ceramic boards It is difficult to solve the power noise problem in the structure, in the current ceramic board structure, the decoupling capacitor is installed in the outer area of ​​the board surface spaced from the detection pin area

Method used

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  • A plate used for a probe card, a manufacturing method thereof and the probe card
  • A plate used for a probe card, a manufacturing method thereof and the probe card
  • A plate used for a probe card, a manufacturing method thereof and the probe card

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Embodiment approach

[0041] According to an exemplary embodiment of the concept of the present invention, the LTCC may contain alumina (Al2 o 3 ) and glass. The LTCC based on 100 parts by mass of alumina may include 100 to 233 parts by mass of glass.

[0042] The glass can be M-Al-Si-O-based (M is Ca, Sr or Ba) glass-ceramics, or Si-B-R-O-based (R is Li, Na, K and other alkali metals) borosilicate glass.

[0043] The LTCC according to the exemplary embodiment of the concept of the present invention may include 25 to 40 wt % of M element (M is Ca, Sr or Ba), 30 to 45 wt % of aluminum (Al), 5 to 200 wt % of silicon (Si ) and 0.1 to 5 wt% of other added elements (Zn, B, Mg, etc.) glass, but the concept of the present invention is not limited thereto.

[0044] Due to the low melting point of glass, LTCC can be sintered at 900°C or lower. For example, LTCC can be sintered at 870°C.

[0045] In addition, the flexural strength of LTCC may be 150 MPa to 350 MPa, but the inventive concept is not limite...

experiment example

[0113] Table 1 below shows the values ​​included in a board for a probe card in which capacitors are embedded according to an embodiment of the concept of the present invention by changing the bending strength of the ceramic board and the load applied to the ceramic board. Data obtained for the minimum thickness of the first insulating layer.

[0114] In the experimental example shown in Table 1, a cavity with a horizontal length of 1.3 mm and a vertical height of 0.8 mm was used, and conductive vias with a diameter of 0.06 mm and detection pins with a pitch of 0.3 mm were used.

[0115] Table 1

[0116]

[0117] The load applied to the ceramic plate can be calculated as a result of the load applied to one pin (approximately 0.006 kg) and the number of pins present in the area of ​​the cavity.

[0118]Therefore, the degree of integration of the conductive vias in the first insulating layer and the detection pins can be changed according to the degree of integration of the ...

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Abstract

A plate used for a probe card is provided and comprises: a ceramic plate; conductive patterns; a conductive via hole; and a capacitor, wherein the ceramic plate comprises a first insulation layer, and a second insulation layer disposed on a surface of the first insulation layer; the second insulation layer comprises a cavity for accommodating an electronic component; the conductive patterns are disposed on the first insulation layer and the second insulation layer; the conductive via hole is electrically connected to the conductive patterns; and the capacitor is disposed in the cavity. The depth of the cavity is larger than the thickness of the capacitor so as to ensure space in the lower part of the cavity after the cavity accommodates the capacitor.

Description

[0001] Cross References to Related Applications [0002] This application claims Korean Patent Application No. 10-2013-0088976 filed with the Korean Intellectual Property Office on July 26, 2013 and Korean Patent Application No. 10-2014-0027688 filed with the Korean Intellectual Property Office on March 10, 2014 The entire contents of both applications are hereby incorporated by reference in their entirety. technical field [0003] The inventive concept generally relates to a board for a probe card in which a capacitor is embedded, a method of manufacturing the same, and a probe card. Background technique [0004] Unless otherwise indicated herein, the materials described in this section are not prior art to the claims in the present invention and are not admitted to be prior art by inclusion in this section. Semiconductor elements are manufactured through a fabrication process and an assembly process. The manufacturing process includes forming circuit patterns and contact...

Claims

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Application Information

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IPC IPC(8): G01R1/073H05K1/18
CPCG01R1/06733G01R1/07342G01R3/00
Inventor 赵范俊崔重讴罗智星朴胤辉吴光宰秋昊成申知桓
Owner 塞姆西恩有限公司