Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for manufacturing resistor, resistor and circuit

A manufacturing method and technology of resistors, applied in the direction of resistors, resistor manufacturing, thick film resistors, etc., can solve the problem of increased resistance and achieve the effect of improving reliability

Active Publication Date: 2018-10-12
ZTE CORP
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a method for manufacturing a resistor, a resistor and a circuit, which solves the problem that the resistance value becomes larger due to electrode corrosion in the current technology

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for manufacturing resistor, resistor and circuit
  • Method for manufacturing resistor, resistor and circuit
  • Method for manufacturing resistor, resistor and circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] The resistor manufacturing method provided by the present invention can be used in a wide range of resistor production fields, and can prevent the electrode of the resistor from being ineffective due to corrosion. The following takes the resistor as a thick film chip resistor as an example, and through specific embodiments The present invention is further explained in conjunction with the accompanying drawings.

[0033] figure 2 A schematic structural diagram of a resistor provided for an embodiment of the present invention, such as figure 2 As shown, the resistor provided by the present invention includes: an insulating base 21, a resistor 22 arranged on the insulating base 21, a first electrode 23a and a second electrode 23b respectively connected to the resistor 22, and the first electrode 23b connected to the first electrode In addition to the first conductive layer 24a at least partially overlapping the second electrode 23a and the second conductive layer 24b at...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A resistor and manufacturing method thereof, and circuit, the resistor comprising: an insulating substrate (21); a resistor (22) disposed on the insulating substrate (21); a first electrode (23a) and a second electrode (23b) respectively connected to the resistor (22); a first conductive layer (24a) partially overlapping with the first electrode (23a); a second conductive layer (24b) partially overlapping with the second electrode (23b); a first barrier layer (25a) disposed between the first electrode (23a) and the first conductive layer (24a) to prevent external corrosive from contacting the first electrode (23a), and / or a second barrier layer (25b) disposed between the second electrode (23b) and the second conductive layer (24b) to prevent external corrosive from contacting the second electrode (23b). Adding a barrier layer between an electrode and a conductive layer prevents external corrosive from contacting the electrode, thus avoiding corrosion of the electrode due to the contact with the external corrosive.

Description

technical field [0001] The invention relates to the field of resistors, in particular to a method for manufacturing a resistor, a resistor and a circuit. Background technique [0002] With the development of communication technology, the quality requirements for communication equipment, especially communication circuits, are becoming increasingly stringent. At present, the vulcanization phenomenon of resistor equipment, especially thick film chip resistors, is also becoming more and more serious. [0003] The structure diagram of the existing thick film chip resistor is as follows figure 1 shown, refer to figure 1 As shown, the existing thick film chip resistors include: ceramic insulating substrate 1, bottom electrodes (2a and 2b), top electrodes (3a and 3b), side electrodes (4a and 4b) and The resistor body 5, the dielectric layer 6 arranged on the resistor body, the protective layer 7 and the electroplating layer (electroplated nickel layers 8a and 8b, electroplated tin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01C17/00H01C7/00H01C1/14
CPCH01C17/065H01C7/003
Inventor 王能极王志坚张彦春李建邦向振红黄黎明石代军
Owner ZTE CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products