Preparation method of gold-containing three-layer micro-profile electrical contact material
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CHONGQING CHUANYI AUTOMATION
- Publication Date
- 2017-06-06
Smart Images

Figure 1
Abstract
Description
technical field
[0001] The invention relates to a material compounding method, in particular to a preparation method of a gold-containing three-layer micro-shaped electrical contact material. Background technique
[0002] The gold-containing three-layer micro-shaped electrical contact material is a type of special-shaped composite material with a small cross-section to meet the needs of the development of relays and switch thermostats in the direction of miniaturization, high precision, and integration. Gold-containing three-layer micro-shaped electrical contact materials are usually composed of substrate copper alloy, precious metal silver alloy and gold alloy, and its cross-sectional area is ≤1mm 2 , and the cross-section is irregular, mostly triangular, trapezoidal and other shapes, which changed the early single noble metal and its alloy materials in many fields often could not meet the special performance requirements. Therefore, materials with different properties are ...