Chamfer processing method of PDC (Polycrystalline Diamond Compact)
A processing method and chamfering technology, which is applied in metal processing equipment, manufacturing tools, welding equipment, etc., can solve problems affecting the surface quality of chamfered surfaces, achieve the goals of improving chamfering processing efficiency, reducing thermal burns, and improving surface quality Effect
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[0017] The technical solutions of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0018] Such as figure 1 The PDC sheet shown includes a sintered alloy substrate 1 and a PDC superhard layer 2 (diamond layer), and chamfers are processed on the outer end of the PDC superhard layer 2. Unlike traditional grinding, the present invention adopts laser The processing technology realizes the processing of chamfering.
[0019] The basic steps of the laser processing technology are that the laser probe of the laser remains still, and the laser emits high-frequency (20-200kHz, preferably 80-130kHz) high-energy (20-200μJ, preferably 200μJ) pulses in a directional manner. The direction of the probe is moved to complete the positioning (moving speed is 1-10mm / s, preferably 5-8mm / s), and then the fixture of the worktable holds the PDC sheet to be chamfered, so that it rotates at a high speed relative to the lase...
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