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Chamfer processing method of PDC (Polycrystalline Diamond Compact)

A processing method and chamfering technology, which is applied in metal processing equipment, manufacturing tools, welding equipment, etc., can solve problems affecting the surface quality of chamfered surfaces, achieve the goals of improving chamfering processing efficiency, reducing thermal burns, and improving surface quality Effect

Inactive Publication Date: 2015-03-04
LANGFANG SUPOWER DIAMOND TECH
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Problems solved by technology

However, for the chamfering of the diamond superhard layer of the PDC sheet, the grinding method is generally used to process it, which can easily cause tiny mechanical damage, which affects the surface quality of the chamfered surface to a certain extent, and the processing efficiency needs to be further improved.

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  • Chamfer processing method of PDC (Polycrystalline Diamond Compact)

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Embodiment Construction

[0017] The technical solutions of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0018] Such as figure 1 The PDC sheet shown includes a sintered alloy substrate 1 and a PDC superhard layer 2 (diamond layer), and chamfers are processed on the outer end of the PDC superhard layer 2. Unlike traditional grinding, the present invention adopts laser The processing technology realizes the processing of chamfering.

[0019] The basic steps of the laser processing technology are that the laser probe of the laser remains still, and the laser emits high-frequency (20-200kHz, preferably 80-130kHz) high-energy (20-200μJ, preferably 200μJ) pulses in a directional manner. The direction of the probe is moved to complete the positioning (moving speed is 1-10mm / s, preferably 5-8mm / s), and then the fixture of the worktable holds the PDC sheet to be chamfered, so that it rotates at a high speed relative to the lase...

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Abstract

The invention provides a chamfer processing method of a PDC (Polycrystalline Diamond Compact). A laser probe of a laser is kept still, the laser directionally emits pulses, a workbench moves towards the direction of the laser probe, a clamp of the workbench is used for clamping the PDC to rotate relative to the laser probe, and a PDC superhard layer of the PDC corresponds to the laser probe in position, wherein the frequency of the pulses directionally emitted by the laser is 20-200kHz; the single pulse energy emitted by the laser is 20-200 mu J; the movement speed of the workbench is 1-10mm / s; the rotating speed of the PDC is 5-1000rpm. According to the chamfer processing method, a laser processing technology is used for replacing a traditional milling mode, so that the chamfer processing efficiency is greatly improved, the parameters of the laser processing technology are defined, and the surface quality of chamfers is remarkably improved.

Description

technical field [0001] The invention relates to the field of superhard material processing, in particular to a chamfering processing method of a PDC sheet. Background technique [0002] Polycrystalline Diamond Compact (PDC) is a new type of functional material sintered with diamond micropowder and cemented carbide substrate under ultra-high pressure and high temperature conditions. It has both high hardness and high wear resistance of diamond. And thermal conductivity, but also has the strength and impact toughness of cemented carbide, it is an ideal material for manufacturing cutting tools, drilling bits and other wear-resistant tools. However, for the chamfering of the diamond superhard layer of the PDC sheet, the grinding method is generally used at present, which can easily cause slight mechanical damage, which affects the surface quality of the chamfered surface to a certain extent, and the processing efficiency needs to be further improved. Contents of the invention ...

Claims

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Application Information

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IPC IPC(8): B23K26/361B23K26/40
CPCB23K26/361
Inventor 陈继锋陈工作李世界
Owner LANGFANG SUPOWER DIAMOND TECH