Plating device
A technology of electroplating equipment and electroplating production line, which is applied in the direction of electrolysis process and electrolysis components, and can solve the problems of hydrogen embrittlement strength reduction and other problems
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[0019] The embodiments of the present invention will be described below according to the drawings. However, the embodiment shown below is to embody the technical idea of the present invention, and the electroplating device is exemplified, and the electroplating device of the present invention does not specifically refer to the following electroplating device.
[0020] In addition, in order to make the claims easier to understand, numbers corresponding to the parts shown in the embodiment are attached to the parts shown in the [Claims] and [Means to Solve the Problem]. However, the components shown in the claims are by no means specific to the components of the embodiment.
[0021] The electroplating device of the present invention is used for galvanizing the surface of metal parts such as screws, heat-treating the hydrogen intruded into the metal lattice in the galvanizing process, that is, baking, driving out hydrogen, eliminating hydrogen embrittlement, and then galvanizin...
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