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Laser power supply water cooling radiator and laser power supply

A technology of water-cooled radiators and lasers, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., to achieve the effect of improving the sealing effect and strengthening the heat dissipation effect

Active Publication Date: 2017-06-27
HANS LASER TECH IND GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the embodiments of the present invention is to address the above-mentioned deficiencies in the prior art, to provide a new laser power supply water-cooled radiator and a laser power supply using this radiator, to solve the problems of laser power supply heat dissipation, waterproof, and dustproof, and to ensure that the laser power supply works reliability

Method used

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  • Laser power supply water cooling radiator and laser power supply
  • Laser power supply water cooling radiator and laser power supply
  • Laser power supply water cooling radiator and laser power supply

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Embodiment Construction

[0021] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0022] The invention provides a firm and reliable laser power supply water cooling radiator.

[0023] Such as figure 1 As shown, the new laser power supply water cooling radiator includes a substrate 1 , a heat dissipation pipe 2 and a heat dissipation pipe joint 3 . Specifically, a groove is provided on the surface of the substrate 1 , and two openings are provided on the substrate 1 for the groove, and a positioning groove is also provided at the opening of the groove. The two ends of the heat dissipation pipe 2 are water inlet and water outlet respectively, and the cooling water flows in from ...

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Abstract

The invention relates to a water-cooled heat sink of a laser device power supply. The water-cooled heat sink comprises a substrate, a radiating tube and radiating tube joints, wherein the substrate is provided with a groove and positioning grooves, the radiating tube is embedded into the groove, and two ends of the radiating tube serve as a water inlet and a water outlet respectively and are welded with the radiating tube joints. Positioning plates are arranged on two sides of the radiating tube joints and are embedded into the positioning grooves by tight clamping to limit the radiating tube joints to rotate optionally. The invention further relates to the laser device power supply. The laser device power supply comprises a box, a cover plate, a heating unit and the water-cooled heat sink which form a sealed space, a circuit portion of the power supply is sealed in the space and water and dust cannot enter the space, so that operation reliability of the laser device power supply is ensured while radiating is conducted effectively.

Description

technical field [0001] The invention belongs to the technical field of power supplies, and in particular relates to a water-cooled radiator for a laser power supply and a laser power supply using the radiator. Background technique [0002] The power of the laser power supply is large, and the heat is also large, which affects the reliability of the power supply. Fans or water-cooled radiators are usually used in the industry to dissipate heat. Although the heat is solved, it brings waterproof and dustproof problems to the laser power supply. [0003] Using a fan for heat dissipation is easy to inhale dust. Dust in the power supply will affect its working performance, and even cause the power supply to burn out in severe cases. [0004] When using a water-cooled radiator to dissipate heat, the joint of the cooling water pipe connected to the cooling water is suspended without reliable fixation. water leakage. In addition, the laser power supply environment is prone to cond...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02M1/00H05K7/20
CPCH02M1/00H05K7/209H05K7/20936
Inventor 赵维安梁剑寒陈根余陈燚高云峰
Owner HANS LASER TECH IND GRP CO LTD