A rapid compression molding process for multi-layer flexible board
A flexible board and compression molding technology, which is applied in the manufacturing of multilayer circuits, electrical components, printed circuits, etc., can solve the problems of restricting the quality of lamination of multilayer flexible boards, false scrap rate, etc., and achieves good bubble removal effect. , The effect of reducing equipment and environmental costs, and convenient operation
Active Publication Date: 2017-05-03
HUIZHOU KING BROTHER CIRCUIT TECH +2
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Problems solved by technology
[0004] The present invention aims at the problem that the air bubbles existing in the existing fast pressing technology cannot be completely removed, which seriously restricts the pressing quality of multi-layer flexible boards and the falsely high scrapping rate, forming a A multi-layer flexible board rapid compression molding process, which has the characteristics of good bubble removal effect, convenient operation, low cost and wide versatility
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[0025] In order to further understand the content of the present invention, the content of the invention and specific embodiments are specifically described below:
[0026] Such as figure 1 Shown, a kind of multi-layer flexible plate rapid compression molding process comprises the following steps:
[0027] The first step is the material cutting process, and the flexible board and pure rubber film are cut according to the process size;
[0028] The second step, drilling processing, selects the non-formed area in the graphic of the flexible board, locates the air holes in the flexible board according to a certain interval, and performs drilling processing at the positioning position of the air holes to form the air holes;
[0029] The third step is the pre-treatment of the film. The flexible board that has been drilled in the second step is subjected to circuit production, AOI inspection, and browning production to complete the pre-treatment of the film;
[0030] The fourth st...
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The invention relates to the field of manufacturing and processing technologies for printed circuit boards, and provides a quick press molding process for multilayer flexible plates. The quick press molding process includes steps of cutting processing, drilling machining, film adhering pre-processing, single-layer flexible plate quick press molding, multilayer flexible plate quick press molding and the like. Exhaust holes are formed in non-molded regions of flexible plates to form bubble passing discharging channels, so that bubbles among layers of the multilayer flexible plates can be effectively removed by means of step-by-step exhaust pre-press molding and quick press molding. The quick press molding process for the multilayer flexible plates has the advantages of good bubble removing effects, convenience and speediness in operation, low cost and wide universality.
Description
technical field [0001] The invention relates to the technical field of printed circuit board processing, in particular to a multi-layer flexible board rapid compression molding process. Background technique [0002] The general production process for the production of multi-layer flexible boards is: material cutting → line production → pure rubber film, flexible board alignment pressing → post-processing, in which the air bubbles between the flexible board layers must be effectively removed during the pressing process. The impact on the performance of multi-layer flexible boards is particularly critical. Currently, commonly used lamination techniques include fast pressing and traditional vacuum pressure transmission. Traditional vacuum pressure transmission can provide a vacuum environment, which can effectively avoid the generation of air bubbles during the lamination process. However, the high temperature and high pressure of traditional vacuum pressure transmission can ea...
Claims
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IPC IPC(8): H05K3/46
CPCH05K3/4611H05K3/4638H05K2203/166
Inventor 林启恒林映生陈春卫雄武守坤刘敏严俊锋
Owner HUIZHOU KING BROTHER CIRCUIT TECH