Resin dispensing device

Abstract

The invention provides a resin dispensing device having a dispensing head unit. The abovementioned dispensing head unit includes: a dispensing head main body; a needle component; a resin injection portion; an injector; and a flow path changer lever arranged to be able to slide inside the abovementioned dispensing head main body and to selectively communicate the abovementioned resin filling cylinder and the abovementioned needle component or communicate the abovementioned resin filling cylinder and the abovementioned injector, when the abovementioned resin filling cylinder is communicated with the abovementioned injector, resin housed in the abovementioned injector is filled in the abovementioned resin filling cylinder, and when the abovementioned resin filling cylinder is communicated with the abovementioned needle component, resin filled in the abovementioned resin filling cylinder is discharged through the abovementioned needle component, the abovementioned resin injection portion includes a piston component which is slidably arranged inside the abovementioned resin filling cylinder and pushes resin filled in the abovementioned resin filling cylinder towards a lower part, and an exhaust vent which discharges air outwards when resin is filled is formed at one side of an upper end part of the abovementioned resin filling cylinder.

Description

technical field [0001] The present invention relates to a resin coating device for coating epoxy resin on components such as chips and IC chips mounted on a lead frame, and more particularly, to a resin coating device capable of coating a certain amount of resin by improving the structure. Background technique [0002] In general, resin coating devices (coating machines) suitable for the following processes are widely used in various technologies: In order to mount surface mount components (chips, ICs) on printed circuit boards (PCB: Printed Circuit Board), coating (Dispensing) Viscous solution such as epoxy resin, or in order to protect the semiconductor element from the external environment, coat and encapsulate the edge of the chip (chip), and underfill the flip chip (underfill). [0003] Korean Patent No. 10-0578693 discloses a structure in which the resin contained in the syringe is pressurized by the injection pressure of the pump method, and the tip of the point rod m...

AI Technical Summary

Problems solved by technology

[0006] However, in the resin coating device disclosed in Korean Patent No. 1082999, when it is used for a long time or restarted after supplying resin into the syringe, air is formed between the filled resin and the piston member in the resin filling cylinder. layer, the piston member presses the air layer to push the filled resin downward, so a certain amount of resin cannot be continuously discharged

[0007] That is, the force with which the piston member pushes the resin is constant, but when there is an air layer in the resin filling cylinder and when there is no air layer, the thickness of the formed air layer is different from the force that the piston member pushes the resin. With a certain force, there is a difference in the amount of resin pushed downward, and finally, a certain amount of resin cannot be discharged

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