Pressing and fixing assembly used for packaging transistors
A technology for fixing components and transistors, which is used in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, and electrical solid-state devices. Production management costs, great process complexity, and the effect of reducing the size of the whole machine
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[0039] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.
[0040] refer to figure 1As shown, a pressing and fixing assembly for packaging transistors includes a PCBA board 2 and a transistor 5. The pressing and fixing assembly includes a combined metal spring 7 and a plastic fixing part 8, and the plastic fixing part 8 is composed of a side wall Form a cavity with the bottom wall, the inner wall of the cavity and / or the inner bottom wall are provided with an inner buckle 9 and a support rib 10, and the metal shrapnel 7 is fixed on the plastic fixing part by being inserted between the inner buckle 9 and the support rib 10 8, a supporting step 11 is provided on the inner wall and / or inner bottom wall of the cavity, and an outer buckle 12 extending outward along the opposite direction of the metal dome 7 is provided on the outer bottom wall of the cavity.
[0041] It also includes the assembly...
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