Unlock instant, AI-driven research and patent intelligence for your innovation.

Power-type LED integrated packaging structure

An integrated packaging and power-type technology, applied in the field of power-type LED integrated packaging structure, can solve the problem that the heat dissipation capacity still needs to be improved, and achieve the effect of improving the heat dissipation effect and increasing the current density

Inactive Publication Date: 2015-03-25
陈畅
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Even so, a single LED product is currently only at the level of 1-10W, and the heat dissipation capacity still needs to be improved

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Power-type LED integrated packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0017] refer to figure 1 As shown, a power type LED integrated packaging structure includes a heat dissipation heat pipe 1, a CuW heat sink 2, a Si substrate 3, an LED chip 6 and a sapphire 8, and the heat dissipation heat pipe 1 is arranged at the bottom of the structure. The CuW heat sink 2 is disposed above the heat dissipation heat pipe 1, the Si substrate 3 is disposed above the CuW heat sink 2, the LED chip 6 is disposed above the Si substrate 3, and the LED chip 6 is disposed above the Si substrate 3. Set with 8 of the sapphires.

[0018] Further, the LED chip 6 includes a P electrode and an N electrode, a metal bump 5 is respectively arranged under the P electrode and the N electrode, and the outer side of the Si substrate 3 and the LED chip 6 is connected by a gold wire. 4 connection, and a silver photoreflective layer 7 i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a power-type LED integrated packaging structure which comprises a radiating heat tube, a CuW heat sink, a Si substrate, an LED chip and a sapphire. The radiating heat tube is arranged at the bottommost end of the structure. The CuW heat sink is arranged on the radiating heat tube. The Si substrate is arranged on the CuW heat sink. The LED chip is arranged on the Si substrate. The sapphire is arranged on the LED chip. By the adoption of the technical scheme, the current density of the chip is increased; the heat dissipation effect is further improved; a silver reflection layer eliminates the light blocking phenomenon caused by an electrode and a lead, and therefore the structure has optimal characteristics with respect to electricity, light, heat and the like.

Description

technical field [0001] The invention relates to the technical fields of optics, heat, electricity, mechanics, structure and technology of LED packaging, and in particular to a power LED integrated packaging structure. Background technique [0002] With the development of lighting technology, high-power white LED will be the core of future lighting. As a new type of light source, white LED has the advantages of long life, small size, energy saving, high efficiency, fast response, shock resistance, and no pollution compared with traditional light sources. It is considered to be a "green lighting source" that can enter the field of general lighting, especially The birth of high-power white LED is called "the fourth revolution in the field of lighting" by the industry, and the large-scale application of LED in general lighting is an inevitable trend. [0003] At present, the driving current of many high-power LEDs reaches 350mA, 700mA, or even 1A, which will cause heat accumula...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64H01L33/38H01L33/46
CPCH01L33/38H01L33/46H01L33/48H01L33/642H01L33/648H01L2224/16145H01L2224/45144H01L2224/48463H01L2924/00
Inventor 黄克亚尤凤翔陈畅
Owner 陈畅