Chip-integrated fingerprint identification sensor and manufacturing method thereof
A technology for fingerprint identification and production methods, applied in character and pattern recognition, semiconductor/solid-state device manufacturing, instrumentation, etc., to solve problems such as low efficiency, time-consuming assembly or packaging process, adverse effects on final product yield and reliability, etc.
Inactive Publication Date: 2015-04-01
HUATIAN TECH XIAN
View PDF7 Cites 5 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
As the number of discrete components increases, the process steps become more and more complex, and the manufacturing cost increases. At the same time, it has an adverse effect on the yield and reliability of the final product, and the assembly or packaging process of discrete components is time-consuming and inefficient.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0022] The present invention will be further described below according to the accompanying drawings.
[0023] like image 3 As shown, a chip-integrated fingerprint recognition sensor, the sensor is composed of a substrate 1, a memory chip 2, a bonding wire 3, an application-specific integrated circuit chip 4, a sensor chip 5, and a plastic package 6; The integrated circuit chip 4 and the sensor chip 5 are on the substrate 1, and the three are respectively connected to the substrate 1 by bonding wires 3, and the memory chip 2 and the ASIC chip 4 are located in the cavity formed by the sensor chip 5 and the substrate 1 ; The plastic package 6 wraps the sensing chip 5 and the bonding wire 3 .
[0024] The upper surface of the sensor chip 5 is exposed, which can improve the sensing effect.
[0025] The bare space on the upper part of the sensing chip 5 has a sapphire, glass or ceramic cover.
[0026] The plastic package 6 fills the cavity formed by the sensor chip 5 and the sub...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a chip-integrated fingerprint identification sensor and a manufacturing method of the chip-integrated fingerprint identification sensor. The sensor is composed of a base plate, a storage chip, bonding wires, a special integrated circuit chip, a sensing chip and a plastic package body. The storage chip, the special integrated circuit chip and the sensing chip are integrated on the base plate and are connected with the base plate respectively through the bonding wires, and the storage chip and the special integrated circuit chip are located in a cavity formed by the sensing chip and the base plate; the plastic package body comprises the sensing chip and the bonding wires, and the upper surface of the sensing chip is exposed. According to the chip-integrated fingerprint identification sensor and the manufacturing method of the chip-integrated fingerprint identification sensor, the structural size is reduced and processes are simplified through chip integration, and the sensing effect is improved due to the fact that the sensing chip is exposed.
Description
technical field [0001] The invention relates to technologies such as microelectronic package technology, sensor technology and chip interconnection, in particular to a chip-integrated fingerprint identification sensor and a manufacturing method thereof. Background technique [0002] With the continuous improvement of the intelligence of terminal products, various sensor chips emerge in endlessly. Sensor chips have expanded the application fields of smart phones, tablet computers and other products. For example, the emergence of fingerprint recognition chips has greatly improved the security of the above products. [0003] At present, a typical fingerprint identification sensor chip includes a semiconductor chip on which an array of sensor elements for sensing is formed as a sensing area. Its biggest feature is that the sensing area on the chip surface interacts with the user's finger to generate electric signal. In order to ensure the accuracy and sensitivity of sensing, t...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00H01L25/18H01L23/31H01L21/98
CPCH01L25/00H01L23/3185G06V40/13H01L2224/48091H01L2924/00014
Inventor 谢建友陈兴隆
Owner HUATIAN TECH XIAN