Photosensitive film leaf spring type crusher for PCB

A crushing device and spring leaf technology, applied in grain processing, etc., can solve the problem of low crushing efficiency of knives, achieve the effect of improving effect, reducing cost, reducing process and cost

Inactive Publication Date: 2015-04-08
WUXI DERBELL PHTO ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is: to overcome the technical problem of low cutter crushing efficiency in the prior art, and to provide a photosensitive film spring leaf type crushing device for PCB

Method used

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  • Photosensitive film leaf spring type crusher for PCB
  • Photosensitive film leaf spring type crusher for PCB

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Embodiment Construction

[0018] The present invention is described in further detail now in conjunction with accompanying drawing. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.

[0019] Such as Figure 1~2 As shown, the present invention is a photosensitive film spring leaf crushing device for PCB, including a driving mechanism, and the spring leaf crushing device also includes a crushing bucket 1 and a spring leaf crushing mechanism, and the spring leaf crushing mechanism is arranged in the crushing barrel 1, the spring piece crushing mechanism includes a guide plate and a grinding spring piece 4, the guide plate is conical, and a number of spiral guide grooves A6 are arranged on the surface of the guide plate, and the guide plate is coaxially connected with the crushing bucket 1 , the guide plate is connected to the drive mechanism ...

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Abstract

The invention discloses a photosensitive film leaf spring type crusher for a PCB. The photosensitive film leaf spring type crusher comprises a driving mechanism, a crushing barrel and a leaf spring crushing mechanism, wherein the leaf spring crushing mechanism is arranged in the crushing barrel, and comprises a guide plate and grinding leaf springs; the guide plate is conical; the surface of the guide plate is provided with a plurality of spiral guide grooves A; the guide plate and the crushing barrel are coaxially and rotationally connected; the conical tip end of the guide plate is arranged opposite to the bottom of the crushing barrel; a crushing clearance is formed between the edge of the guide plate and the inner wall of the crushing barrel; the leaf spring crushing mechanism comprises a plurality of grinding leaf springs arranged on the edge of the guide plate; each grinding leaf spring comprises a grinding plane; each grinding plane is provided with a plurality of guide grooves B; the inner wall of the crushing barrel is provided with a plurality of guide grooves C perpendicular to the axes of the guide grooves B; the grinding planes of the grinding leaf springs are fit to the inner wall of the crushing barrel elastically.

Description

technical field [0001] The invention relates to a photosensitive film spring leaf type crushing device for PCB, which belongs to a photosensitive film material crushing mechanism. Background technique [0002] The development of modern engineering technology and the transformation of the new material industry require many raw materials and products in the state of powder. The pulverizer is the main powder-making equipment for obtaining fine powder. Especially nowadays, environmental protection and resource reuse are emphasized. The finished products of many industrial products After use, it can be recycled into raw materials, which can increase the production cost of the company. The waste materials after production of the photosensitive film can be recycled. At present, the shredder used uses the moving knife and the fixed knife to cut each other to realize the mutual cutting of the moving knife and the fixed knife. , so as to crush the photosensitive film, the distance bet...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B02C19/00
CPCB02C19/0012B02C19/0056
Inventor 朱贤红
Owner WUXI DERBELL PHTO ELECTRONICS MATERIAL
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