Method for adhering paperboard material and lamination material

A cardboard and film-covering technology, applied in the direction of bonding methods, adhesives, etc., can solve problems such as unfavorable environmental protection, failure to meet high standards of use, and inability to seal, and achieve improved heat resistance and chemical stability, and adhesion Effective and environmentally friendly, good adhesion effect

Active Publication Date: 2015-04-08
鹤山市泓轩文化用品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the prior art, most of the methods of bonding film-covered materials and cardboard materials are bonded by organic compound adhesives. This method is not conducive to envi

Method used

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Embodiment Construction

[0021] The technical solutions of the present invention will be further described below through specific embodiments.

[0022] A method for bonding a cardboard material and a film covering material, said method comprising the steps of:

[0023] Step 1. Set the energization time t of the cardboard material after laminating the film material according to the thickness of the cardboard material to be bonded, and place the cardboard material after laminating the film material on the first conductive sheet. This implementation In the method, the first conductive sheet is the lower conductive sheet, and the second conductive sheet is the upper conductive sheet, wherein one end surface of the cardboard material is horizontally placed on the first conductive sheet, that is, the lower conductive sheet, and placed on the same horizontal plane as the lower conductive sheet , press the pressing switch, the second conductive sheet, that is, the upper conductive sheet, presses the cardboard...

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PUM

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Abstract

The invention discloses a method for adhering a paperboard material and a lamination material and belongs to the field of lamination methods. The method is designed for solving the problem that by the conventional method, the paperboard material and the lamination material are poor in sealing property and not environmentally friendly. The method for adhering the paperboard material and the lamination material at least comprises the following steps: step 1, placing the paperboard material attached to the lamination material on a first conducting strip, pressing a second conducting strip to the paperboard material attached to the lamination material; and step 2, electrifying the first conducting strip and/or the second conducting strip for a preset time t, wherein resonance is generated between molecules in the paperboard material and the lamination material so as to achieve mutual permeation and adhesion by virtue of the current generated between the first conducting strip and the second conducting strip. By the method, the paperboard material and the lamination material are good in adhesive effect and environmentally friendly.

Description

technical field [0001] The invention relates to the field of film covering methods, in particular to a method for bonding paperboard materials and film covering materials. Background technique [0002] In order to improve its rigidity, shrinkage, strength, heat resistance and other parameter properties, the cardboard material usually needs to be coated on its surface. Among them, the bonding of the film material and the cardboard material is a key step, which determines the quality of the film coating. The success or failure of craftsmanship. [0003] In the prior art, most of the methods of bonding film-covered materials and cardboard materials are bonded by organic compound adhesives. This method is not conducive to environmental protection and the bonding effect is not ideal, and some methods are realized by sewing. Adhesive, but cannot be sealed and does not meet high standards of use after bonding. Contents of the invention [0004] The object of the present inventi...

Claims

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Application Information

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IPC IPC(8): C09J5/00
Inventor 黄江明
Owner 鹤山市泓轩文化用品有限公司
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