Method for adhering paperboard material and lamination material
A cardboard and film-covering technology, applied in the direction of bonding methods, adhesives, etc., can solve problems such as unfavorable environmental protection, failure to meet high standards of use, and inability to seal, and achieve improved heat resistance and chemical stability, and adhesion Effective and environmentally friendly, good adhesion effect
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[0021] The technical solutions of the present invention will be further described below through specific embodiments.
[0022] A method for bonding a cardboard material and a film covering material, said method comprising the steps of:
[0023] Step 1. Set the energization time t of the cardboard material after laminating the film material according to the thickness of the cardboard material to be bonded, and place the cardboard material after laminating the film material on the first conductive sheet. This implementation In the method, the first conductive sheet is the lower conductive sheet, and the second conductive sheet is the upper conductive sheet, wherein one end surface of the cardboard material is horizontally placed on the first conductive sheet, that is, the lower conductive sheet, and placed on the same horizontal plane as the lower conductive sheet , press the pressing switch, the second conductive sheet, that is, the upper conductive sheet, presses the cardboard...
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