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Wafer Transfer Tool

A wafer and tool technology, applied in the field of wafer transfer and selection tools, can solve the problems of wafer breakage, low operation efficiency, inconvenient operation, etc., and achieve the effect of reducing wafer loss

Active Publication Date: 2017-10-24
SUZHOU ASEN SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Manual handling has the following risks: direct contact with hands may cause product contamination, electrostatic damage, etc., resulting in product defects; improper human actions may cause wafer breakage
There are the following risks in vacuum suction pen picking up wafers: direct contact between the suction pen and the suction cup may cause scratches on the wafer surface; round drop

Method used

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Examples

Experimental program
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Embodiment Construction

[0026] The detailed description of the drawings is intended as a description of presently preferred embodiments of the invention and is not intended to represent the only forms in which the invention can be embodied. It is to be understood that the same or equivalent function may be performed by different embodiments, which are intended to be encompassed within the spirit and scope of the invention.

[0027] Figure 1A A schematic perspective view of the wafer transfer tool 100 in one embodiment is shown. As shown, the wafer transfer tool 100 includes a first platform 101 and a second platform 102 . The first platform 101 and the second platform 102 remain flush, and can be folded or separated along the sliding track (not shown in the figure), Figure 1A The case where the two are separated is shown in . The first platform 101 has a limit corner 112 and a card slot 114, wherein the card slot 114 is used for connecting with a wafer transition box 151 (shown in Figure 1D , ...

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PUM

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Abstract

The present invention relates to wafer transfer tools. A wafer transfer tool includes: a first platform and a second platform that are kept flush and can be closed or separated along sliding rails; the first platform has limit corners and a first card slot for the wafer transition box It is fixed on the first platform and its opening direction faces the second platform; the second platform has a second card slot, the first column and the second column; the first column and the second column have grooves To accommodate the bottom support of the wafer magazine, the second slot is used to engage with the clamping part of the wafer magazine, so as to fix the wafer magazine on the second platform and make its opening direction face the first platform; The inner sides of the first column and the second column are aligned with the hollow opening of the bottom support part of the wafer magazine. This tool avoids the risk of existing wafer transfer methods to reduce wafer loss.

Description

technical field [0001] The present invention relates generally to chip packaging and, more particularly, to tools for wafer transfer and picking. Background technique [0002] During the process of wafer packaging and testing, wafers need to be frequently transferred or selected. At present, wafers are usually picked up manually or picked up by vacuum pens during magazine transfer or selection. Manual handling has the following risks: direct contact with hands may cause product contamination, electrostatic damage, etc., resulting in product defects; improper human actions may cause wafer breakage. There are the following risks in vacuum suction pen picking up wafers: the suction pen and the suction cup directly contact the wafer surface, which is likely to cause scratches; round drop. Contents of the invention [0003] There is a need to improve the current way wafers are transferred or picked in magazines. [0004] In one embodiment of the present invention, a wafer t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677H01L21/687
CPCH01L21/677H01L21/687
Inventor 余志军
Owner SUZHOU ASEN SEMICON CO LTD