Colloid removing method of quad flat no-lead packaging chip

Abstract

A colloid removing method of a quad flat no-lead packaging chip is used for solving the existing problem of poor yield of quad flat no-lead packaging chips. The colloid removing method of the quad flat no-lead packaging chip includes: an image of a substrate is obtained by photographing through a photomicrography device, a plurality of chips are packaged in the substrate, the chips are electrically connected with a plurality of lead frames, the lead frames are formed on a surface of the substrate, and colloids are arranged among lead frames; the image of the substrate is loaded by use of an arithmetic unit, based on which image analysis operation is executed to locate the chips packaged in the substrate; and the arithmetic unit compares each chip with a sample image, so as to detect the part of the lead frame electrically connected with each chip which is covered by residual gum of the colloid and is judged to be a redundant block of the colloid that needs ablation, a laser trajectory of a laser generator is set according to the redundant block, and the laser generator ablates and removes the redundant block of the colloid.

Description

technical field [0001] The invention relates to a deglue method for a square flat non-lead packaging chip, in particular to a deglue method for a square flat non-lead package chip that utilizes laser beam ablation to remove glue. Background technique [0002] Please refer to figure 1 and 2 Shown is a substrate 1 (substrate) used in a known quad flat no-lead package (QFN package) process, and a plurality of chips 2 (die) are packaged in the substrate 1 . The substrate 1 includes a plurality of heat sinks 11 (thermal pads), and corresponding to each of the heat sinks 11, a plurality of lead frames 12 (lead frames) are respectively provided, and the heat sink 11 and the plurality of lead frames 12 are formed on the substrate 1 A surface 1a of. Each of the chips 2 can be respectively bonded to the plurality of heat sinks 11 , and electrically connected to the plurality of lead frames 12 corresponding to each of the heat sinks 11 . Wherein, there is a colloid 3 (mold cap) bet...

AI Technical Summary

Problems solved by technology

[0006] In summary, there is an urgent need to provide a further improved method for removing glue from QFN packaged chips, so as to improve the disadvantage that the glue 3 is difficult to remove due to the residual glue 31 produced by overflowing glue after the above-mentioned chip 2 is packaged, and effectively improve Production yield of QFN packaged wafers

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