Device for determining heat-conductivity coefficient

A measuring device and thermal conductivity technology, applied in the field of thermal conductivity measuring devices, can solve the problems of low accuracy, high cost, complicated operation, etc., and achieve the goal of reducing contact thermal resistance, improving accuracy and objectivity, and improving accuracy Effect

Active Publication Date: 2015-04-22
EVE RUBBER RES INST +1
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Problems solved by technology

[0018] Aiming at the deficiencies of the prior art, in order to improve the accuracy of the thermal conductivity testing device, the present invention designs a new s

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  • Device for determining heat-conductivity coefficient
  • Device for determining heat-conductivity coefficient
  • Device for determining heat-conductivity coefficient

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specific Embodiment approach 2

[0046] The device for measuring thermal conductivity of flexible materials is characterized in that: the device includes: a test cavity 9, a hot end heating system 10, a cold end cooling system 14, a vacuum system 12, a temperature acquisition system 13, a pressure control system 11; A test bench 15 with an overall up-and-down structure. From bottom to top, the heating block 8, the lower indenter 7, the sample to be tested 5, the upper indenter 2, and the cooling block 1, are arranged on the surface of the upper and lower indenters. Temperature measurement sensor group 3, temperature measurement sensors are connected to the temperature acquisition and processing system 13; the heating block 8 is connected to the hot end heating system 10, the cooling block 1 is connected to the cold end cooling system 14, and the temperature acquisition and processing system 13 Complete data collection, online processing, and test result output in a timely manner; the setting method of the tempe...

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Abstract

The invention relates to a device for determining the heat-conductivity coefficient. The device comprises a testing cavity, a hot-end heating system, a cold-end cooling system, a vacuumizing system, a temperature acquisition system and a pressure control system, wherein a testing platform is arranged in the testing cavity; and the whole testing platform is of an upper-lower structure and is provided with a heating block, a down-pressing head, a sample to be tested, an upper pressing head and a cooling block in sequence from bottom to top. The device disclosed by the invention has the advantages that the horizontal temperature gradient of the sample to be tested is simulated by arranging multiple horizontal temperature-measuring points, the heat transferring characteristic of the sample to be tested is objectively reflected by multi-point temperature testing, and the more objective value of the heat-conductivity coefficient is obtained by means of data processing. Simultaneously, high-heat-conductivity flexible thin pieces are arranged between the sample to be tested and the pressing heads, so that the thermal contact resistance is reduced and the accuracy of the tested value is improved. In addition, a limiting ring is arranged between the pressing heads, so that the operability and the accuracy of the test in testing the flexible sample are guaranteed. The accuracy and the objectivity of the test for the heat-conductivity coefficient are greatly improved.

Description

Technical field [0001] The invention relates to a measuring device for thermal conductivity, in particular to a measuring device for measuring the thermal conductivity of solid materials. Background technique [0002] The thermal conductivity of materials is an important parameter index for studying the physical properties of materials. In scientific research, teaching, production and other departments, it is required to predict or measure the thermal conductivity of materials. Thermal conductivity is a physical quantity reflecting the thermal conductivity of materials. It is not only a basis for evaluating the thermal properties of materials, but also a design basis for materials in application. Therefore, the measurement of thermal conductivity of materials in scientific experiments and engineering technology has become a new development. The key to the material. [0003] There are currently three main methods for measuring the thermal conductivity of materials: [0004] 1. Laser...

Claims

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Application Information

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IPC IPC(8): G01N25/20
CPCG01N25/20
Inventor 王正戴德盈吴鹏章李柯颖
Owner EVE RUBBER RES INST
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