Liquid quantitative supply device

Abstract

The invention belongs to the technical field of wafer gluing-development crafts, particularly provides a liquid quantitative supply device. The liquid quantitative supply device comprises a liquid supplement bucket, a liquid supply tank, a nozzle connecting pipe, a gas source and a control system, wherein the liquid supplement bucket is connected with the gas source and the liquid supply tank through a gas pipeline and a liquid supplement pipeline respectively; a liquid supplement medical liquid valve is arranged on the liquid supplement pipeline; the nozzle connecting pipe is positioned below the liquid supply tank, and communicated with the liquid supply tank through a liquid supply pipeline; a liquid supply medical liquid valve is arranged on the liquid supply pipeline; both the liquid supplement medical liquid valve and the liquid supply medical liquid valve are connected with the control system; the control system enables the distance between the work position of the liquid level in the liquid supply tank and the nozzle connecting pipe to be constant through the liquid supplement medical liquid valve and the liquid supply medical liquid valve, so that a liquid can be quantitatively supplied under constant pressure. The liquid quantitative supply device has the advantages that pressure generated from the self weight of the liquid is used for the liquid supply; as both the liquid supplement medical liquid valve and the liquid supply medical liquid valve are connected with the control system, automatic liquid supplement and quantitative supply can be realized; bubbles can be removed from the liquid during the liquid supply process.

Description

Technical field [0001] The invention belongs to the technical field of wafer coating and development technology, in particular to a liquid quantitative supply device. A protective film is formed on the semiconductor wafer or its coating and a quantitative liquid medicine is provided in the development process after the wafer is exposed. Background technique [0002] At present, in the process of forming a protective film on a semiconductor wafer or its coating and in the development process after the wafer is exposed, the known liquid supply device mainly adopts a method of pumping or pressing compressed gas from a sealed barrel. A part of the gas will be dissolved in the liquid pressed out from the sealed barrel by compressed gas, and bubbles will be generated during the process, which will affect the process effect. In addition, it is difficult to control the flow of liquid supplied each time in this way, which will cause liquid waste in the process. Summary of the invention ...

AI Technical Summary

Problems solved by technology

Part of the gas will be dissolved in the liquid pressed out of the sealed barrel by using compressed gas, and bubbles will be generated during the process, which will affect the process effect

In addition, it is difficult to control the liquid flow rate supplied each time in this way, which will cause liquid waste in the process

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